View source for 18495368. METHOD AND SYSTEM FOR DIE BONDING (CANON KABUSHIKI KAISHA)

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=METHOD AND SYSTEM FOR DIE BONDING=


==Organization Name==

[[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]


[[Category:CANON KABUSHIKI KAISHA]]

==Inventor(s)==

[[:Category:Nilabh K Roy of Austin TX US|Nilabh K Roy of Austin TX US]][[Category:Nilabh K Roy of Austin TX US]]

[[:Category:Byung-Jin Choi of Austin TX US|Byung-Jin Choi of Austin TX US]][[Category:Byung-Jin Choi of Austin TX US]]

==METHOD AND SYSTEM FOR DIE BONDING==


This abstract first appeared for US patent application 18495368 titled 'METHOD AND SYSTEM FOR DIE BONDING

==Original Abstract Submitted==

A bonding method includes providing a source substrate, the source substrate includes active side alignment marks on an active side of the source substrate, first non-active side alignment marks and second non-active side alignment marks on a non-active side of the source substrate, and obtaining positions of the active side alignment marks and positions of the first non-active side alignment marks of the source substrate, and determining alignment marks placement errors based on offsets between the positions of the active-side alignment marks and the positions of the first non-active side alignment marks in the X, Y, and θ directions.



[[Category:H01L21/68]]
[[Category:H01L21/67]]
[[Category:H01L21/687]]
[[Category:H01L23/00]]
[[Category:CPC_H01L21/681]]