View source for 18473905. SELECTIVE LAYER TRANSFER (Intel Corporation)

=SELECTIVE LAYER TRANSFER=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Adel Elsherbini of Chandler AZ US|Adel Elsherbini of Chandler AZ US]][[Category:Adel Elsherbini of Chandler AZ US]]

[[:Category:Thomas L. Sounart of Chandler AZ US|Thomas L. Sounart of Chandler AZ US]][[Category:Thomas L. Sounart of Chandler AZ US]]

[[:Category:Feras Eid of Chandler AZ US|Feras Eid of Chandler AZ US]][[Category:Feras Eid of Chandler AZ US]]

[[:Category:Tushar Kanti Talukdar of Wilsonville OR US|Tushar Kanti Talukdar of Wilsonville OR US]][[Category:Tushar Kanti Talukdar of Wilsonville OR US]]

[[:Category:Brandon M. Rawlings of Chandler AZ US|Brandon M. Rawlings of Chandler AZ US]][[Category:Brandon M. Rawlings of Chandler AZ US]]

[[:Category:Andrey Vyatskikh of Hillsboro OR US|Andrey Vyatskikh of Hillsboro OR US]][[Category:Andrey Vyatskikh of Hillsboro OR US]]

[[:Category:Carlos Bedoya Arroyave of Portland OR US|Carlos Bedoya Arroyave of Portland OR US]][[Category:Carlos Bedoya Arroyave of Portland OR US]]

[[:Category:Kimin Jun of Portland OR US|Kimin Jun of Portland OR US]][[Category:Kimin Jun of Portland OR US]]

[[:Category:Shawna M. Liff of Scottsdale AZ US|Shawna M. Liff of Scottsdale AZ US]][[Category:Shawna M. Liff of Scottsdale AZ US]]

[[:Category:Grant M. Kloster of Lake Oswego OR US|Grant M. Kloster of Lake Oswego OR US]][[Category:Grant M. Kloster of Lake Oswego OR US]]

[[:Category:Richard F. Vreeland of Beaverton OR US|Richard F. Vreeland of Beaverton OR US]][[Category:Richard F. Vreeland of Beaverton OR US]]

[[:Category:William P. Brezinski of Beaverton OR US|William P. Brezinski of Beaverton OR US]][[Category:William P. Brezinski of Beaverton OR US]]

[[:Category:Johanna Swan of Scottsdale AZ US|Johanna Swan of Scottsdale AZ US]][[Category:Johanna Swan of Scottsdale AZ US]]

==SELECTIVE LAYER TRANSFER==


This abstract first appeared for US patent application 18473905 titled 'SELECTIVE LAYER TRANSFER

==Original Abstract Submitted==

Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a layer of integrated circuit (IC) components is received, and a second substrate with one or more adhesive areas is received. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.



[[Category:H01L21/683]]
[[Category:H01L23/00]]
[[Category:H01L25/065]]
[[Category:CPC_H01L21/6835]]