View source for 18465791. SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)

=SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF=


==Organization Name==

[[:Category:ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE|ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE]]


[[Category:ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE]]

==Inventor(s)==

[[:Category:Dae Seon Kim of Daejeon (KR)|Dae Seon Kim of Daejeon (KR)]][[Category:Dae Seon Kim of Daejeon (KR)]]

[[:Category:Jong Jin Lee of Daejeon (KR)|Jong Jin Lee of Daejeon (KR)]][[Category:Jong Jin Lee of Daejeon (KR)]]

==SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18465791 titled 'SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF

==Simplified Explanation==

The present disclosure describes a surface mount type optical module and a compact and lightweight optical module attachment/detachment apparatus for mounting the optical module on a system board or package submount. The apparatus automates the loading/unloading, alignment, and laser soldering processes to facilitate easy attachment and detachment of the optical module in a confined space.

* Body frame for the attachment/detachment apparatus
* Fixing part to secure the body frame to the board
* Gripper for gripping the optical module
* Aligning part to align the position of the optical module with the board
* Laser part for non-contact bonding between the optical module and the board

== Potential Applications ==
The technology can be used in various industries such as telecommunications, data centers, and consumer electronics for mounting optical modules on system boards or package submounts.

== Problems Solved ==
1. Simplifies the process of attaching and detaching optical modules in confined spaces
2. Automates loading/unloading, alignment, and soldering processes for efficiency

== Benefits ==
1. Compact and lightweight design
2. Easy attachment and detachment of optical modules
3. Facilitates non-contact bonding for secure mounting

== Potential Commercial Applications ==
Optical communication systems, networking equipment, consumer electronics, medical devices

== Possible Prior Art ==
Prior art may include manual methods of attaching and detaching optical modules, which can be time-consuming and less efficient compared to the automated apparatus described in this disclosure.

== Unanswered Questions ==
1. What specific types of optical modules are compatible with this attachment/detachment apparatus?
2. Are there any limitations to the size or weight of the optical modules that can be mounted using this technology?


==Original Abstract Submitted==

The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.



[[Category:G02B6/12]]
[[Category:G02B6/122]]
[[Category:G02B7/00]]
[[Category:H01S3/03]]