View source for 18465533. SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Jin Hyuk Choi of Suwon-si (KR)|Jin Hyuk Choi of Suwon-si (KR)]][[Category:Jin Hyuk Choi of Suwon-si (KR)]]

[[:Category:Beom Soo Hwang of Suwon-si (KR)|Beom Soo Hwang of Suwon-si (KR)]][[Category:Beom Soo Hwang of Suwon-si (KR)]]

[[:Category:Kong Woo Lee of Suwon-si (KR)|Kong Woo Lee of Suwon-si (KR)]][[Category:Kong Woo Lee of Suwon-si (KR)]]

[[:Category:Myung Ki Song of Suwon-si (KR)|Myung Ki Song of Suwon-si (KR)]][[Category:Myung Ki Song of Suwon-si (KR)]]

[[:Category:Ja-Yul Kim of Suwon-si (KR)|Ja-Yul Kim of Suwon-si (KR)]][[Category:Ja-Yul Kim of Suwon-si (KR)]]

[[:Category:Kyu Sang Lee of Suwon-si (KR)|Kyu Sang Lee of Suwon-si (KR)]][[Category:Kyu Sang Lee of Suwon-si (KR)]]

[[:Category:Hyun Joo Jeon of Suwon-si (KR)|Hyun Joo Jeon of Suwon-si (KR)]][[Category:Hyun Joo Jeon of Suwon-si (KR)]]

[[:Category:Nam Young Cho of Suwon-si (KR)|Nam Young Cho of Suwon-si (KR)]][[Category:Nam Young Cho of Suwon-si (KR)]]

==SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18465533 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

==Simplified Explanation==

The semiconductor manufacturing equipment described in the patent application includes a process chamber, a front-end module with a transfer robot, a transfer chamber, and a cassette for replaceable components.

* The process chamber is used for treating substrates.
* The front-end module includes a transfer robot that transports substrates in containers.
* The transfer chamber facilitates loading and unloading substrates into and out of the process chamber.
* The cassette can hold replaceable components for use in the process chamber.
* The front-end module has a seat plate that can retract or extend to load cassettes.

== Potential Applications ==
This technology can be applied in semiconductor manufacturing processes where precise handling and treatment of substrates are required.

== Problems Solved ==
This innovation streamlines the process of loading and unloading substrates in semiconductor manufacturing, improving efficiency and reducing the risk of damage to delicate components.

== Benefits ==
The benefits of this technology include increased automation, improved substrate handling, and enhanced overall manufacturing efficiency.

== Potential Commercial Applications ==
This technology can be utilized in semiconductor fabrication facilities to enhance productivity and quality control processes.

== Possible Prior Art ==
One possible prior art could be similar semiconductor manufacturing equipment with automated substrate handling capabilities.

=== Unanswered Questions ===

=== How does this technology impact production costs in semiconductor manufacturing? ===
This technology can potentially reduce production costs by increasing efficiency and minimizing substrate damage, leading to higher yields and lower scrap rates.

=== What are the environmental implications of using this technology in semiconductor manufacturing? ===
The environmental implications of this technology may include reduced energy consumption and waste generation due to improved process efficiency and substrate handling.


==Original Abstract Submitted==

A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.



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