18465533. SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jin Hyuk Choi of Suwon-si (KR)

Beom Soo Hwang of Suwon-si (KR)

Kong Woo Lee of Suwon-si (KR)

Myung Ki Song of Suwon-si (KR)

Ja-Yul Kim of Suwon-si (KR)

Kyu Sang Lee of Suwon-si (KR)

Hyun Joo Jeon of Suwon-si (KR)

Nam Young Cho of Suwon-si (KR)

SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18465533 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

Simplified Explanation

The semiconductor manufacturing equipment described in the patent application includes a process chamber, a front-end module with a transfer robot, a transfer chamber, and a cassette for replaceable components.

• The process chamber is used for treating substrates.
• The front-end module includes a transfer robot that transports substrates in containers.
• The transfer chamber facilitates loading and unloading substrates into and out of the process chamber.
• The cassette can hold replaceable components for use in the process chamber.
• The front-end module has a seat plate that can retract or extend to load cassettes.

Potential Applications

This technology can be applied in semiconductor manufacturing processes where precise handling and treatment of substrates are required.

Problems Solved

This innovation streamlines the process of loading and unloading substrates in semiconductor manufacturing, improving efficiency and reducing the risk of damage to delicate components.

Benefits

The benefits of this technology include increased automation, improved substrate handling, and enhanced overall manufacturing efficiency.

Potential Commercial Applications

This technology can be utilized in semiconductor fabrication facilities to enhance productivity and quality control processes.

Possible Prior Art

One possible prior art could be similar semiconductor manufacturing equipment with automated substrate handling capabilities.

How does this technology impact production costs in semiconductor manufacturing?

This technology can potentially reduce production costs by increasing efficiency and minimizing substrate damage, leading to higher yields and lower scrap rates.

What are the environmental implications of using this technology in semiconductor manufacturing?

The environmental implications of this technology may include reduced energy consumption and waste generation due to improved process efficiency and substrate handling.

Original Abstract Submitted

A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.