View source for 18211044. COPPER REFLOW BY SURFACE MODIFICATION (Applied Materials, Inc.)

=COPPER REFLOW BY SURFACE MODIFICATION=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Zhiyuan Wu of San Jose CA (US)|Zhiyuan Wu of San Jose CA (US)]][[Category:Zhiyuan Wu of San Jose CA (US)]]

[[:Category:Zheng Ju of Sunnyvale CA (US)|Zheng Ju of Sunnyvale CA (US)]][[Category:Zheng Ju of Sunnyvale CA (US)]]

[[:Category:Feng Chen of San Jose CA (US)|Feng Chen of San Jose CA (US)]][[Category:Feng Chen of San Jose CA (US)]]

[[:Category:Kevin Kashefi of San Ramon CA (US)|Kevin Kashefi of San Ramon CA (US)]][[Category:Kevin Kashefi of San Ramon CA (US)]]

[[:Category:Feng Q. Liu of San Jose CA (US)|Feng Q. Liu of San Jose CA (US)]][[Category:Feng Q. Liu of San Jose CA (US)]]

[[:Category:Jeffrey W. Anthis of San Jose CA (US)|Jeffrey W. Anthis of San Jose CA (US)]][[Category:Jeffrey W. Anthis of San Jose CA (US)]]

==COPPER REFLOW BY SURFACE MODIFICATION==


This abstract first appeared for US patent application 18211044 titled 'COPPER REFLOW BY SURFACE MODIFICATION




==Original Abstract Submitted==

Embodiments of the disclosure relate to methods of etching a copper material. In some embodiments, the copper material is exposed to a halide reactant to form a copper halide species. The substrate is then heated to remove the copper halide species. In some embodiments, the etching methods are performed at relatively low temperatures. Additional embodiments of the disclosure relate to methods of copper gapfill. In some embodiments, a copper material within a substrate feature is exposed to a halide reactant to form a copper halide species. The copper halide species is then heated and flowed to fill at least a portion of the substrate feature. The reflow methods are performed at lower temperatures than similar reflow methods without formation of the copper halide species.



[[Category:H01L21/3213]]
[[Category:H01L21/3205]]
[[Category:CPC_H01L21/32133]]