18211044. COPPER REFLOW BY SURFACE MODIFICATION (Applied Materials, Inc.)
COPPER REFLOW BY SURFACE MODIFICATION
Organization Name
Inventor(s)
Zhiyuan Wu of San Jose CA (US)
Kevin Kashefi of San Ramon CA (US)
Feng Q. Liu of San Jose CA (US)
Jeffrey W. Anthis of San Jose CA (US)
COPPER REFLOW BY SURFACE MODIFICATION
This abstract first appeared for US patent application 18211044 titled 'COPPER REFLOW BY SURFACE MODIFICATION
Original Abstract Submitted
Embodiments of the disclosure relate to methods of etching a copper material. In some embodiments, the copper material is exposed to a halide reactant to form a copper halide species. The substrate is then heated to remove the copper halide species. In some embodiments, the etching methods are performed at relatively low temperatures. Additional embodiments of the disclosure relate to methods of copper gapfill. In some embodiments, a copper material within a substrate feature is exposed to a halide reactant to form a copper halide species. The copper halide species is then heated and flowed to fill at least a portion of the substrate feature. The reflow methods are performed at lower temperatures than similar reflow methods without formation of the copper halide species.