View source for 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Wensen Hung of Zhubei City (TW)|Wensen Hung of Zhubei City (TW)]][[Category:Wensen Hung of Zhubei City (TW)]]

[[:Category:Tsung-Yu Chen of Hsinchu (TW)|Tsung-Yu Chen of Hsinchu (TW)]][[Category:Tsung-Yu Chen of Hsinchu (TW)]]

==Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18150853 titled 'Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same

==Simplified Explanation==

The method described in the patent application involves attaching a permeable plate, made of a metallic material, to a metal lid. A liquid-metal-comprising media, which contains a liquid metal, is dispensed onto a first package component. The first package component is then bonded to a second package component. The metal lid is attached to the second package component, and during this process, the liquid-metal-comprising media migrates into the permeable plate, forming a composite thermal interface material.

* The method involves attaching a permeable plate to a metal lid.
* The permeable plate is made of a metallic material.
* A liquid-metal-comprising media, containing a liquid metal, is dispensed onto a first package component.
* The first package component is bonded to a second package component.
* The metal lid is attached to the second package component.
* During the attachment process, the liquid-metal-comprising media migrates into the permeable plate.
* This migration forms a composite thermal interface material.

Potential Applications:
* Electronics packaging industry
* Thermal management in electronic devices
* Heat dissipation in high-performance computing systems

Problems Solved:
* Improving thermal management in electronic devices
* Enhancing heat dissipation capabilities
* Addressing thermal issues in high-performance computing systems

Benefits:
* Improved thermal conductivity
* Enhanced heat dissipation efficiency
* Increased reliability and lifespan of electronic devices
* Better performance in high-performance computing systems


==Original Abstract Submitted==

A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.



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