View source for 18091368. ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Kyuhwan Lee of Suwon-si, (KR)|Kyuhwan Lee of Suwon-si, (KR)]][[Category:Kyuhwan Lee of Suwon-si, (KR)]]

[[:Category:Min Park of Suwon-si (KR)|Min Park of Suwon-si (KR)]][[Category:Min Park of Suwon-si (KR)]]

[[:Category:Haejin Lee of Suwon-si (KR)|Haejin Lee of Suwon-si (KR)]][[Category:Haejin Lee of Suwon-si (KR)]]

[[:Category:Jaeheung Ye of Suwon-si (KR)|Jaeheung Ye of Suwon-si (KR)]][[Category:Jaeheung Ye of Suwon-si (KR)]]

[[:Category:Yeonkyung Chung of Suwon-si (KR)|Yeonkyung Chung of Suwon-si (KR)]][[Category:Yeonkyung Chung of Suwon-si (KR)]]

==ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18091368 titled 'ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL

==Simplified Explanation==

The abstract describes an electronic device with a printed circuit board (PCB) structure that incorporates a thermal interface material (TIM). The PCB structure includes a base plate, two components, an interposer, a cover plate, and an accommodation part for the TIM.

* The electronic device has a PCB structure that houses a thermal interface material (TIM).
* The PCB structure consists of a base plate, two components, an interposer, a cover plate, and an accommodation part for the TIM.
* The first component is placed on the base plate, while the second component is separate from the first component.
* The interposer is connected to the base plate and surrounds both the first and second components.
* The cover plate is connected to the interposer and covers both the first and second components.
* The accommodation part is located between the base plate and a heat conduction plate and is designed to hold the TIM.

==Potential Applications==
* This technology can be applied in various electronic devices that require efficient thermal management, such as computers, smartphones, and servers.
* It can be used in high-performance devices that generate a significant amount of heat, ensuring proper cooling and preventing overheating.

==Problems Solved==
* The incorporation of a thermal interface material helps to improve heat dissipation and thermal conductivity within the electronic device.
* The design of the PCB structure with the interposer and cover plate provides better thermal management and protection for the components.

==Benefits==
* Enhanced thermal management capabilities result in improved performance and reliability of the electronic device.
* The use of a thermal interface material helps to prevent overheating and potential damage to the components.
* The PCB structure with the interposer and cover plate offers better protection against external factors and physical damage.


==Original Abstract Submitted==

An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.



[[Category:H05K1/02]]