View source for 18081948. SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

=SUBSTRATE DRYING DEVICE AND METHOD OF  DRYING SUBSTRATE USING THE SAME=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Ansook Sul of Hwaseong-si (KR)|Ansook Sul of Hwaseong-si (KR)]][[Category:Ansook Sul of Hwaseong-si (KR)]]

[[:Category:Sungyong Park of Suwon-si (KR)|Sungyong Park of Suwon-si (KR)]][[Category:Sungyong Park of Suwon-si (KR)]]

[[:Category:Sejin Park of Hwaseong-si (KR)|Sejin Park of Hwaseong-si (KR)]][[Category:Sejin Park of Hwaseong-si (KR)]]

[[:Category:Donok Choi of Yongin-si (KR)|Donok Choi of Yongin-si (KR)]][[Category:Donok Choi of Yongin-si (KR)]]

==SUBSTRATE DRYING DEVICE AND METHOD OF  DRYING SUBSTRATE USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18081948 titled 'SUBSTRATE DRYING DEVICE AND METHOD OF  DRYING SUBSTRATE USING THE SAME

==Simplified Explanation==

The abstract describes a substrate drying device that uses supercritical fluid and ultrasonic waves to dry a wafer. The device includes an upper chamber body, a lower chamber body, and a plurality of vibration devices.

* The upper chamber body has an inlet to introduce supercritical fluid into a chamber space.
* The lower chamber body has an outlet to discharge the supercritical fluid out of the chamber space.
* The plurality of vibration devices consist of vibration modules that generate ultrasonic waves with different frequencies.
* Substrate holders are arranged on the vibration modules to hold a wafer.
* The vibration devices are arranged in the chamber space.

== Potential Applications ==
* Semiconductor manufacturing: Drying wafers after various processes.
* Electronics manufacturing: Drying substrates used in electronic devices.
* Optical device manufacturing: Drying optical substrates for improved performance.

== Problems Solved ==
* Efficient drying: The use of supercritical fluid and ultrasonic waves allows for faster and more effective drying of substrates.
* Uniform drying: The arrangement of vibration devices ensures even drying across the entire substrate surface.
* Gentle drying: The use of ultrasonic waves minimizes the risk of damage to delicate substrates.

== Benefits ==
* Faster drying time: The combination of supercritical fluid and ultrasonic waves accelerates the drying process.
* Improved quality: Uniform and gentle drying helps maintain the integrity of the substrate and reduces defects.
* Energy efficiency: The device optimizes the use of supercritical fluid and ultrasonic waves, reducing energy consumption.


==Original Abstract Submitted==

A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.



[[Category:H01L21/67]]
[[Category:B08B7/00]]
[[Category:B08B3/12]]
[[Category:H01L21/02]]
[[Category:H01L21/687]]