18081948. SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME
Organization Name
Inventor(s)
Ansook Sul of Hwaseong-si (KR)
Sungyong Park of Suwon-si (KR)
Sejin Park of Hwaseong-si (KR)
SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18081948 titled 'SUBSTRATE DRYING DEVICE AND METHOD OF DRYING SUBSTRATE USING THE SAME
Simplified Explanation
The abstract describes a substrate drying device that uses supercritical fluid and ultrasonic waves to dry a wafer. The device includes an upper chamber body, a lower chamber body, and a plurality of vibration devices.
- The upper chamber body has an inlet to introduce supercritical fluid into a chamber space.
- The lower chamber body has an outlet to discharge the supercritical fluid out of the chamber space.
- The plurality of vibration devices consist of vibration modules that generate ultrasonic waves with different frequencies.
- Substrate holders are arranged on the vibration modules to hold a wafer.
- The vibration devices are arranged in the chamber space.
Potential Applications
- Semiconductor manufacturing: Drying wafers after various processes.
- Electronics manufacturing: Drying substrates used in electronic devices.
- Optical device manufacturing: Drying optical substrates for improved performance.
Problems Solved
- Efficient drying: The use of supercritical fluid and ultrasonic waves allows for faster and more effective drying of substrates.
- Uniform drying: The arrangement of vibration devices ensures even drying across the entire substrate surface.
- Gentle drying: The use of ultrasonic waves minimizes the risk of damage to delicate substrates.
Benefits
- Faster drying time: The combination of supercritical fluid and ultrasonic waves accelerates the drying process.
- Improved quality: Uniform and gentle drying helps maintain the integrity of the substrate and reduces defects.
- Energy efficiency: The device optimizes the use of supercritical fluid and ultrasonic waves, reducing energy consumption.
Original Abstract Submitted
A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.
