View source for 17946947. BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT simplified abstract (Applied Materials, Inc.)

=BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Arun Kumar Kotrappa of Karnataka (IN)|Arun Kumar Kotrappa of Karnataka (IN)]][[Category:Arun Kumar Kotrappa of Karnataka (IN)]]

[[:Category:CHANDRASHEKARA Baginagere of Bengaluru (IN)|CHANDRASHEKARA Baginagere of Bengaluru (IN)]][[Category:CHANDRASHEKARA Baginagere of Bengaluru (IN)]]

[[:Category:RAMCHARAN Sundar of Tamil nadu (IN)|RAMCHARAN Sundar of Tamil nadu (IN)]][[Category:RAMCHARAN Sundar of Tamil nadu (IN)]]

[[:Category:SEYYED Fazeli of Santa Clara CA (US)|SEYYED Fazeli of Santa Clara CA (US)]][[Category:SEYYED Fazeli of Santa Clara CA (US)]]

[[:Category:ANANTHA Subramani of San Jose CA (US)|ANANTHA Subramani of San Jose CA (US)]][[Category:ANANTHA Subramani of San Jose CA (US)]]

[[:Category:SIYU Zhu of Sunnyvale CA (US)|SIYU Zhu of Sunnyvale CA (US)]][[Category:SIYU Zhu of Sunnyvale CA (US)]]

[[:Category:AKHIL Singhal of Portland OR (US)|AKHIL Singhal of Portland OR (US)]][[Category:AKHIL Singhal of Portland OR (US)]]

[[:Category:PHILIP ALLAN Kraus of San Jose CA (US)|PHILIP ALLAN Kraus of San Jose CA (US)]][[Category:PHILIP ALLAN Kraus of San Jose CA (US)]]

==BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17946947 titled 'BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT

==Simplified Explanation==

The semiconductor processing tool described in the abstract is a tool used for processing semiconductors in a chamber. It includes a pedestal, a first gas feed system on one side of the pedestal, and a second gas feed system on the other side of the pedestal.

* The semiconductor processing tool includes a chamber, a pedestal, and two gas feed systems.
* The first gas feed system consists of a first exhaust line with a valve and a first source gas feed line with another valve.
* The second gas feed system includes a second exhaust line with a valve and a second source gas feed line with another valve.

== Potential Applications ==
This technology can be used in the semiconductor industry for various processes such as etching, deposition, and cleaning of semiconductor materials.

== Problems Solved ==
This technology helps in controlling the flow of gases in the chamber during semiconductor processing, ensuring precise and efficient processing of semiconductor materials.

== Benefits ==
The semiconductor processing tool allows for better control and regulation of gas flow, leading to improved quality and consistency in semiconductor processing.

== Potential Commercial Applications ==
One potential commercial application of this technology is in semiconductor manufacturing facilities for the production of electronic devices.

== Possible Prior Art ==
One possible prior art for this technology could be similar semiconductor processing tools with gas feed systems, but with different configurations or functionalities.

== Unanswered Questions ==

=== How does this technology compare to existing semiconductor processing tools in terms of efficiency and precision? ===
This article does not provide a direct comparison between this technology and existing semiconductor processing tools in terms of efficiency and precision.

=== What are the specific semiconductor processing techniques that can benefit the most from this technology? ===
This article does not specify the semiconductor processing techniques that can benefit the most from the use of this technology.


==Original Abstract Submitted==

Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, a pedestal in the chamber, and a first gas feed system on a first side of the pedestal. In an embodiment, the first gas feed system comprises a first exhaust line with a first valve to open and close the first exhaust line, and a first source gas feed line with a second valve to open and close the first source gas feed line. In an embodiment, the semiconductor processing tool further comprises a second gas feed system on a second side of the pedestal. In an embodiment, the second gas feed system comprises a second exhaust line with a third valve to open and close the second exhaust line, and a second source gas feed line with a fourth valve to open and close the second source gas feed line.



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