View source for 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)

=COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Brandon C. Marin of Gilbert AZ (US)|Brandon C. Marin of Gilbert AZ (US)]][[Category:Brandon C. Marin of Gilbert AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Kristof Darmawikarta of Chandler AZ (US)|Kristof Darmawikarta of Chandler AZ (US)]][[Category:Kristof Darmawikarta of Chandler AZ (US)]]

[[:Category:Jeremy D. Ecton of Gilbert AZ (US)|Jeremy D. Ecton of Gilbert AZ (US)]][[Category:Jeremy D. Ecton of Gilbert AZ (US)]]

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

[[:Category:Hiroki Tanaka of Gilbert AZ (US)|Hiroki Tanaka of Gilbert AZ (US)]][[Category:Hiroki Tanaka of Gilbert AZ (US)]]

[[:Category:Pooya Tadayon of Portland OR (US)|Pooya Tadayon of Portland OR (US)]][[Category:Pooya Tadayon of Portland OR (US)]]

==COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17943915 titled 'COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS

==Simplified Explanation==

The abstract describes interposers made of glass with cavities and vias for electronic applications.

* Glass substrate interposers with cavities and vias:
    * Interposers are made of glass substrates.
    * They have a cavity on one surface and a via below it.
    * A pad is located in the cavity over the via.
    * Another pad is on the opposite surface under the via.

== Potential Applications ==
Glass substrate interposers can be used in:
* High-speed electronic devices
* Microelectronics
* Semiconductor packaging

== Problems Solved ==
Glass substrate interposers address issues such as:
* Thermal management
* Electrical performance
* Miniaturization of electronic devices

== Benefits ==
The benefits of glass substrate interposers include:
* Improved signal integrity
* Enhanced thermal dissipation
* Higher reliability in electronic systems

== Potential Commercial Applications ==
Glass substrate interposers can be applied in:
* 5G communication systems
* Automotive electronics
* Internet of Things (IoT) devices

== Unanswered Questions ==
=== How does the glass material affect the performance of the interposers compared to other materials? ===
Glass substrates offer unique properties that may impact the electrical and thermal characteristics of the interposers, but further research is needed to fully understand these effects.

=== What are the limitations of using glass substrate interposers in harsh environments? ===
The durability and reliability of glass substrate interposers in extreme conditions, such as high temperatures or mechanical stress, require investigation to determine their suitability for such applications.


==Original Abstract Submitted==

Embodiments disclosed herein include interposers and methods of forming interposers. In an embodiment, an interposer comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass. In an embodiment, the interposer further comprises a cavity into the first surface of the substrate, a via through the substrate below the cavity, a first pad in the cavity over the via, and a second pad on the second surface of the substrate under the via.



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