View source for 17933187. SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION simplified abstract (QUALCOMM Incorporated)

=SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]

==Inventor(s)==

[[:Category:Qingqing Liang of San Diego CA (US)|Qingqing Liang of San Diego CA (US)]][[Category:Qingqing Liang of San Diego CA (US)]]

[[:Category:Periannan Chidambaram of San Diego CA (US)|Periannan Chidambaram of San Diego CA (US)]][[Category:Periannan Chidambaram of San Diego CA (US)]]

[[:Category:George Pete Imthurn of San Diego CA (US)|George Pete Imthurn of San Diego CA (US)]][[Category:George Pete Imthurn of San Diego CA (US)]]

[[:Category:Stanley Seungchul Song of San Diego CA (US)|Stanley Seungchul Song of San Diego CA (US)]][[Category:Stanley Seungchul Song of San Diego CA (US)]]

==SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17933187 titled 'SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION

==Simplified Explanation==

The patent application describes integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules, resulting in smaller and denser TSVs with low mechanical stress. The denser TSVs allow for more flexible wiring options.

* Through-substrate vias (TSVs) are processed through self-aligned contact modules.
* Smaller and denser TSVs are formed with low mechanical stress.
* Denser TSVs allow for more flexible wiring options.

== Potential Applications ==
The technology can be applied in:
* Semiconductor manufacturing
* Microelectronics industry

== Problems Solved ==
This technology addresses:
* Limitations in TSV density and size
* Mechanical stress in TSV structures

== Benefits ==
The benefits of this technology include:
* Smaller and denser TSVs
* Lower mechanical stress
* More flexible wiring options

== Potential Commercial Applications ==
The technology can be utilized in:
* High-performance computing
* Telecommunications industry

== Possible Prior Art ==
One possible prior art could be:
* Existing methods for TSV processing in integrated circuits

== Unanswered Questions ==

=== How does this technology impact overall circuit performance? ===
The article does not delve into the specific performance improvements or changes that this technology may bring to integrated circuits.

=== Are there any limitations to the size or density of TSVs that can be achieved with this method? ===
The article does not mention any potential limitations or constraints in achieving smaller or denser TSVs using this technology.


==Original Abstract Submitted==

Disclosed are integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules. As a result, much smaller and/or denser TSVs are formed with low mechanical stress. The denser TSVs allow for more flexible wiring options.



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