17933187. SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION simplified abstract (QUALCOMM Incorporated)
Contents
- 1 SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
Organization Name
Inventor(s)
Qingqing Liang of San Diego CA (US)
Periannan Chidambaram of San Diego CA (US)
George Pete Imthurn of San Diego CA (US)
Stanley Seungchul Song of San Diego CA (US)
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17933187 titled 'SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
Simplified Explanation
The patent application describes integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules, resulting in smaller and denser TSVs with low mechanical stress. The denser TSVs allow for more flexible wiring options.
- Through-substrate vias (TSVs) are processed through self-aligned contact modules.
- Smaller and denser TSVs are formed with low mechanical stress.
- Denser TSVs allow for more flexible wiring options.
Potential Applications
The technology can be applied in:
- Semiconductor manufacturing
- Microelectronics industry
Problems Solved
This technology addresses:
- Limitations in TSV density and size
- Mechanical stress in TSV structures
Benefits
The benefits of this technology include:
- Smaller and denser TSVs
- Lower mechanical stress
- More flexible wiring options
Potential Commercial Applications
The technology can be utilized in:
- High-performance computing
- Telecommunications industry
Possible Prior Art
One possible prior art could be:
- Existing methods for TSV processing in integrated circuits
Unanswered Questions
How does this technology impact overall circuit performance?
The article does not delve into the specific performance improvements or changes that this technology may bring to integrated circuits.
Are there any limitations to the size or density of TSVs that can be achieved with this method?
The article does not mention any potential limitations or constraints in achieving smaller or denser TSVs using this technology.
Original Abstract Submitted
Disclosed are integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules. As a result, much smaller and/or denser TSVs are formed with low mechanical stress. The denser TSVs allow for more flexible wiring options.
