View source for 17932659. LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS simplified abstract (International Business Machines Corporation)

=LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS=


==Organization Name==

[[:Category:International Business Machines Corporation|International Business Machines Corporation]]


[[Category:International Business Machines Corporation]]

==Inventor(s)==

[[:Category:Michael Karunendra Selvanayagam of Ossining NY (US)|Michael Karunendra Selvanayagam of Ossining NY (US)]][[Category:Michael Karunendra Selvanayagam of Ossining NY (US)]]

[[:Category:Corrado P. Mancini of Hopewell Junction NY (US)|Corrado P. Mancini of Hopewell Junction NY (US)]][[Category:Corrado P. Mancini of Hopewell Junction NY (US)]]

[[:Category:David Lokken-toyli of White Plains NY (US)|David Lokken-toyli of White Plains NY (US)]][[Category:David Lokken-toyli of White Plains NY (US)]]

[[:Category:Gerald W. Gibson of Danbury CT (US)|Gerald W. Gibson of Danbury CT (US)]][[Category:Gerald W. Gibson of Danbury CT (US)]]

[[:Category:Kathryn Turner Schonenberg of Wappingers Falls NY (US)|Kathryn Turner Schonenberg of Wappingers Falls NY (US)]][[Category:Kathryn Turner Schonenberg of Wappingers Falls NY (US)]]

[[:Category:Shayne Cairns of Valhalla NY (US)|Shayne Cairns of Valhalla NY (US)]][[Category:Shayne Cairns of Valhalla NY (US)]]

==LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17932659 titled 'LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS

==Simplified Explanation==

The method of manufacturing a travelling wave parametric amplifier (TWPA) involves creating a superconducting junction on a substrate and etching trenches through a metal surface and into a layer of dielectric material to define a plurality of fingers in an interdigitated arrangement of capacitors.

* Superconducting junction formed on a substrate
* Trenches etched through metal surface and into dielectric material
* Fingers defined in interdigitated arrangement of capacitors
* Metal and dielectric material remain from etched away surface

== Potential Applications ==
The technology can be applied in:
* Quantum computing
* Telecommunications
* Radar systems

== Problems Solved ==
The technology helps in:
* Enhancing signal amplification
* Improving signal processing efficiency

== Benefits ==
The technology offers:
* High-performance amplification
* Low noise operation
* Compact design

== Potential Commercial Applications ==
The technology can be utilized in:
* High-speed data communication systems
* Satellite communication systems

== Possible Prior Art ==
One possible prior art is the use of superconducting junctions in parametric amplifiers.

=== Unanswered Questions ===

=== How does this technology compare to traditional amplification methods? ===
This technology offers higher performance and efficiency compared to traditional amplification methods, but more research is needed to fully understand the extent of its advantages.

=== What are the potential challenges in scaling up this technology for commercial use? ===
Scaling up this technology for commercial use may face challenges related to manufacturing processes, cost-effectiveness, and integration with existing systems. Further research and development are required to address these challenges.


==Original Abstract Submitted==

A method of manufacturing a travelling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched away through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of capacitors defined by a metal and a dielectric material that remains from the etched away metal surface and the layer of dielectric material.



[[Category:H03F19/00]]