17932659. LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS simplified abstract (International Business Machines Corporation)

LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS

Organization Name

International Business Machines Corporation

Inventor(s)

Michael Karunendra Selvanayagam of Ossining NY (US)

Corrado P. Mancini of Hopewell Junction NY (US)

David Lokken-toyli of White Plains NY (US)

Gerald W. Gibson of Danbury CT (US)

Kathryn Turner Schonenberg of Wappingers Falls NY (US)

Shayne Cairns of Valhalla NY (US)

LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17932659 titled 'LOW LOSS TRAVELLING WAVE PARAMETRIC DEVICES USING PLANAR CAPACITORS

Simplified Explanation

The method of manufacturing a travelling wave parametric amplifier (TWPA) involves creating a superconducting junction on a substrate and etching trenches through a metal surface and into a layer of dielectric material to define a plurality of fingers in an interdigitated arrangement of capacitors.

• Superconducting junction formed on a substrate
• Trenches etched through metal surface and into dielectric material
• Fingers defined in interdigitated arrangement of capacitors
• Metal and dielectric material remain from etched away surface

Potential Applications

The technology can be applied in:

• Quantum computing
• Telecommunications
• Radar systems

Problems Solved

The technology helps in:

• Enhancing signal amplification
• Improving signal processing efficiency

Benefits

The technology offers:

• High-performance amplification
• Low noise operation
• Compact design

Potential Commercial Applications

The technology can be utilized in:

• High-speed data communication systems
• Satellite communication systems

Possible Prior Art

One possible prior art is the use of superconducting junctions in parametric amplifiers.

How does this technology compare to traditional amplification methods?

This technology offers higher performance and efficiency compared to traditional amplification methods, but more research is needed to fully understand the extent of its advantages.

What are the potential challenges in scaling up this technology for commercial use?

Scaling up this technology for commercial use may face challenges related to manufacturing processes, cost-effectiveness, and integration with existing systems. Further research and development are required to address these challenges.

Original Abstract Submitted

A method of manufacturing a travelling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched away through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of capacitors defined by a metal and a dielectric material that remains from the etched away metal surface and the layer of dielectric material.