View source for 17874404. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:JOUNGPHIL Lee of Seoul (KR)|JOUNGPHIL Lee of Seoul (KR)]][[Category:JOUNGPHIL Lee of Seoul (KR)]]

==SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17874404 titled 'SEMICONDUCTOR PACKAGE

==Simplified Explanation==

The patent application describes a semiconductor package that includes a package substrate, a semiconductor device, a package cap, and an adhesive layer. The package cap has a trench with a trapezoidal cross-section, and the adhesive layer fills the trench.

* The semiconductor package includes a package substrate with a mount region and a peripheral region.
* A semiconductor device is mounted on the mount region of the package substrate.
* A package cap is placed on the peripheral region of the package substrate.
* The package cap has a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device.
* The bottom surface of the package cap has a trench with a trapezoidal cross-section.
* The width of the trench decreases in a direction away from the bottom surface of the package cap.
* An adhesive layer is present between the package substrate and the bottom surface of the package cap.
* The adhesive layer is in contact with the top surface of the package substrate and the bottom surface of the package cap.
* The adhesive layer fills the trench.

==Potential Applications==
* Semiconductor packaging industry
* Electronics manufacturing

==Problems Solved==
* Provides improved adhesion between the package substrate and the package cap
* Enhances the structural integrity of the semiconductor package

==Benefits==
* Stronger bond between the package substrate and the package cap
* Increased reliability and durability of the semiconductor package
* Improved protection for the semiconductor device


==Original Abstract Submitted==

Disclosed is a semiconductor package comprising a package substrate having a mount region and a peripheral region that surrounds the mount region, a semiconductor device on the mount region of the package substrate, a package cap on the peripheral region of the package substrate and including a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device, and an adhesive layer between the package substrate and a bottom surface of the package cap. The bottom surface of the package cap has a trench. The trench has a trapezoidal cross-section whose width decreases in a direction receding from the bottom surface of the package cap. The adhesive layer is in contact with a top surface of the package substrate and the bottom surface of the package cap. The adhesive layer fills the trench.



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