View source for 17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:SUNNYEONG Jung of Asan-si (KR)|SUNNYEONG Jung of Asan-si (KR)]][[Category:SUNNYEONG Jung of Asan-si (KR)]]

==WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17827751 titled 'WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME

==Simplified Explanation==

The patent application describes a wiring substrate used in semiconductor packages and methods for fabricating them. The substrate includes a dielectric layer with unit regions, a sawing region, and an edge region. It also includes a first upper protection pattern on the unit regions and sawing region, and a second upper protection pattern on the edge region. The second pattern is made of a different dielectric material than the first pattern.

* The patent application describes a wiring substrate for semiconductor packages.
* The substrate has a dielectric layer with unit regions, a sawing region, and an edge region.
* It includes a first upper protection pattern on the unit regions and sawing region.
* It also includes a second upper protection pattern on the edge region.
* The second pattern is made of a different dielectric material than the first pattern.

Potential applications of this technology:

* Semiconductor packaging industry
* Electronics manufacturing industry

Problems solved by this technology:

* Protection of the wiring substrate in semiconductor packages
* Enhanced reliability and durability of the substrate

Benefits of this technology:

* Improved protection of the unit regions, sawing region, and edge region of the wiring substrate
* Increased reliability and durability of semiconductor packages
* Potential for improved performance and longevity of electronic devices.


==Original Abstract Submitted==

Disclosed are wiring substrates, methods of fabricating the same, and methods of fabricating semiconductor packages. The wiring substrate includes a dielectric layer that includes a plurality of unit regions, a sawing region that surrounds each of the unit regions, and an edge region that surrounds the unit regions and the sawing region, a first upper protection pattern on a top surface of the dielectric layer on the unit regions and the sawing region, and a second upper protection pattern on a top surface of the dielectric layer on the edge region. The second upper protection pattern surrounds the first upper protection pattern when viewed in plan and includes a dielectric material different from a dielectric material of the first upper protection pattern.



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