View source for 17714494. WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Minjoo Kim of Hwaseong-si (KR)|Minjoo Kim of Hwaseong-si (KR)]][[Category:Minjoo Kim of Hwaseong-si (KR)]]

[[:Category:Jungha Kim of Suwon-si (KR)|Jungha Kim of Suwon-si (KR)]][[Category:Jungha Kim of Suwon-si (KR)]]

[[:Category:Jinhyung Tak of Hwaseong-si (KR)|Jinhyung Tak of Hwaseong-si (KR)]][[Category:Jinhyung Tak of Hwaseong-si (KR)]]

==WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17714494 titled 'WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME

==Simplified Explanation==

The abstract describes a method and system for analyzing a wafer map using a neural network. Here is a simplified explanation of the abstract:

* The method involves creating a wafer map based on raw data.
* An inception module, which consists of multiple inception layers, receives a first output feature map generated from the wafer map.
* The inception module then produces a final inception output feature map based on the first output feature map.
* A shortcut connection is established between the first output feature map and the final inception output feature map.
* An addition operation is performed on these two feature maps to generate a second output feature map.

Potential applications of this technology:

* Semiconductor manufacturing: The method can be used to analyze wafer maps in the semiconductor industry, helping to identify defects and improve the manufacturing process.
* Quality control: The system can be employed in various industries to analyze and detect patterns or anomalies in large datasets, aiding in quality control processes.

Problems solved by this technology:

* Complex data analysis: The neural network-based method simplifies the analysis of wafer maps, which are typically large and complex datasets.
* Defect detection: By analyzing the wafer map, the system can identify and locate defects, allowing for timely corrective actions.

Benefits of this technology:

* Improved efficiency: The neural network-based analysis method can automate the process of analyzing wafer maps, saving time and resources.
* Enhanced accuracy: By utilizing a neural network, the system can provide more accurate and reliable results compared to traditional manual analysis methods.
* Real-time analysis: The system can perform analysis in real-time, enabling prompt detection and resolution of issues during the manufacturing process.


==Original Abstract Submitted==

A method of analyzing a wafer map using a neural network and a wafer map analysis system are provided. The method of analyzing a wafer map using a neural network includes creating a wafer map based on raw data, receiving, by an inception module including a plurality of inception layers, a first output feature map created based on the wafer map, outputting, by the inception module, a final inception output feature map based on the first output feature map, connecting the first output feature map to the final inception output feature map through a shortcut connection, and performing an addition operation on the first output feature map and the final inception output feature map to output a second output feature map.



[[Category:G06N3/08]]