17714494. WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

From WikiPatents
Jump to navigation Jump to search

WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Minjoo Kim of Hwaseong-si (KR)

Jungha Kim of Suwon-si (KR)

Jinhyung Tak of Hwaseong-si (KR)

WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17714494 titled 'WAFER MAP ANALYSIS SYSTEM USING NEURAL NETWORK AND METHOD OF ANALYZING WAFER MAP USING THE SAME

Simplified Explanation

The abstract describes a method and system for analyzing a wafer map using a neural network. Here is a simplified explanation of the abstract:

  • The method involves creating a wafer map based on raw data.
  • An inception module, which consists of multiple inception layers, receives a first output feature map generated from the wafer map.
  • The inception module then produces a final inception output feature map based on the first output feature map.
  • A shortcut connection is established between the first output feature map and the final inception output feature map.
  • An addition operation is performed on these two feature maps to generate a second output feature map.

Potential applications of this technology:

  • Semiconductor manufacturing: The method can be used to analyze wafer maps in the semiconductor industry, helping to identify defects and improve the manufacturing process.
  • Quality control: The system can be employed in various industries to analyze and detect patterns or anomalies in large datasets, aiding in quality control processes.

Problems solved by this technology:

  • Complex data analysis: The neural network-based method simplifies the analysis of wafer maps, which are typically large and complex datasets.
  • Defect detection: By analyzing the wafer map, the system can identify and locate defects, allowing for timely corrective actions.

Benefits of this technology:

  • Improved efficiency: The neural network-based analysis method can automate the process of analyzing wafer maps, saving time and resources.
  • Enhanced accuracy: By utilizing a neural network, the system can provide more accurate and reliable results compared to traditional manual analysis methods.
  • Real-time analysis: The system can perform analysis in real-time, enabling prompt detection and resolution of issues during the manufacturing process.


Original Abstract Submitted

A method of analyzing a wafer map using a neural network and a wafer map analysis system are provided. The method of analyzing a wafer map using a neural network includes creating a wafer map based on raw data, receiving, by an inception module including a plurality of inception layers, a first output feature map created based on the wafer map, outputting, by the inception module, a final inception output feature map based on the first output feature map, connecting the first output feature map to the final inception output feature map through a shortcut connection, and performing an addition operation on the first output feature map and the final inception output feature map to output a second output feature map.

Retrieved from "http://wikipatents.org/index.php?title=17714494._WAFER_MAP_ANALYSIS_SYSTEM_USING_NEURAL_NETWORK_AND_METHOD_OF_ANALYZING_WAFER_MAP_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19292"