View source for 17548997. FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Changseok Lee of Gwacheon-si (KR)|Changseok Lee of Gwacheon-si (KR)]][[Category:Changseok Lee of Gwacheon-si (KR)]]

[[:Category:Sangwon Kim of Seoul (KR)|Sangwon Kim of Seoul (KR)]][[Category:Sangwon Kim of Seoul (KR)]]

[[:Category:Keunwook Shin of Yongin-si (KR)|Keunwook Shin of Yongin-si (KR)]][[Category:Keunwook Shin of Yongin-si (KR)]]

==FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17548997 titled 'FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD

==Simplified Explanation==

The patent application describes a method for depositing a film on a non-planar substrate and then etching it. Here is a simplified explanation of the abstract:

* The method starts by preparing a non-planar substrate with a first surface, a second surface, and an inclined surface between them.
* A film is then deposited on the first surface, the second surface, and the inclined surface. The film may have a thickness deviation, meaning it may not be uniform.
* Finally, the deposited film on all surfaces is etched, which means it is selectively removed.

Potential applications of this technology:

* Semiconductor manufacturing: This method could be used in the production of microchips and other electronic devices where non-planar substrates are common.
* Optics: The method may find applications in the production of lenses, mirrors, and other optical components that require precise film deposition on non-planar surfaces.
* Solar cells: Non-planar substrates are often used in solar cell manufacturing, and this method could improve the efficiency and performance of solar panels.

Problems solved by this technology:

* Non-planar substrates pose challenges in film deposition processes. This method provides a solution for depositing films on surfaces with different heights and inclinations.
* The thickness deviation of the film allows for better control and customization of the deposited layer, which can be beneficial in various applications.

Benefits of this technology:

* Improved film deposition on non-planar surfaces: The method allows for more precise and uniform film deposition on surfaces with different heights and inclinations.
* Customizable film thickness: The thickness deviation of the deposited film provides flexibility in tailoring the properties of the film to specific requirements.
* Enhanced performance: By enabling better control over film deposition, this method can contribute to improved performance and efficiency in various industries.


==Original Abstract Submitted==

A film deposition method may include preparing a non-planar substrate including a first surface, a second surface, and an inclined surface between the first surface and the second surface; depositing a film having a thickness deviation on the first surface, the second surface, and the inclined surface; and etching the film deposited on the first surface, the second surface, and the inclined surface. A height of the second surface may be different than a height of the first surface.



[[Category:H01L21/285]]
[[Category:H01L29/40]]