17548997. FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD
Organization Name
Inventor(s)
Changseok Lee of Gwacheon-si (KR)
Keunwook Shin of Yongin-si (KR)
FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17548997 titled 'FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE FILM DEPOSITION METHOD
Simplified Explanation
The patent application describes a method for depositing a film on a non-planar substrate and then etching it. Here is a simplified explanation of the abstract:
- The method starts by preparing a non-planar substrate with a first surface, a second surface, and an inclined surface between them.
- A film is then deposited on the first surface, the second surface, and the inclined surface. The film may have a thickness deviation, meaning it may not be uniform.
- Finally, the deposited film on all surfaces is etched, which means it is selectively removed.
Potential applications of this technology:
- Semiconductor manufacturing: This method could be used in the production of microchips and other electronic devices where non-planar substrates are common.
- Optics: The method may find applications in the production of lenses, mirrors, and other optical components that require precise film deposition on non-planar surfaces.
- Solar cells: Non-planar substrates are often used in solar cell manufacturing, and this method could improve the efficiency and performance of solar panels.
Problems solved by this technology:
- Non-planar substrates pose challenges in film deposition processes. This method provides a solution for depositing films on surfaces with different heights and inclinations.
- The thickness deviation of the film allows for better control and customization of the deposited layer, which can be beneficial in various applications.
Benefits of this technology:
- Improved film deposition on non-planar surfaces: The method allows for more precise and uniform film deposition on surfaces with different heights and inclinations.
- Customizable film thickness: The thickness deviation of the deposited film provides flexibility in tailoring the properties of the film to specific requirements.
- Enhanced performance: By enabling better control over film deposition, this method can contribute to improved performance and efficiency in various industries.
Original Abstract Submitted
A film deposition method may include preparing a non-planar substrate including a first surface, a second surface, and an inclined surface between the first surface and the second surface; depositing a film having a thickness deviation on the first surface, the second surface, and the inclined surface; and etching the film deposited on the first surface, the second surface, and the inclined surface. A height of the second surface may be different than a height of the first surface.
