View source for 17530035. MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)

=MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE=


==Organization Name==

[[:Category:MICROSOFT TECHNOLOGY LICENSING, LLC|MICROSOFT TECHNOLOGY LICENSING, LLC]]


[[Category:MICROSOFT TECHNOLOGY LICENSING, LLC]]

==Inventor(s)==

[[:Category:Dennis Trieu of Calgary (CA)|Dennis Trieu of Calgary (CA)]][[Category:Dennis Trieu of Calgary (CA)]]

[[:Category:Bharath Ramakrishnan of Bellevue WA (US)|Bharath Ramakrishnan of Bellevue WA (US)]][[Category:Bharath Ramakrishnan of Bellevue WA (US)]]

[[:Category:Husam Atallah Alissa of Redmond WA (US)|Husam Atallah Alissa of Redmond WA (US)]][[Category:Husam Atallah Alissa of Redmond WA (US)]]

[[:Category:Robert Jason Lankston, Ii of Woodinville WA (US)|Robert Jason Lankston, Ii of Woodinville WA (US)]][[Category:Robert Jason Lankston, Ii of Woodinville WA (US)]]

[[:Category:Xudong Tang of Sammamish WA (US)|Xudong Tang of Sammamish WA (US)]][[Category:Xudong Tang of Sammamish WA (US)]]

==MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17530035 titled 'MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE

==Simplified Explanation==

The abstract describes a device that simulates thermal loads. It consists of a platform and multiple nodes, with at least one node being movable. The movable node is connected to the platform through a movable stage, allowing it to move relative to the platform.

* The device simulates thermal loads.
* It includes a platform and multiple nodes.
* At least one node is movable.
* The movable node is connected to the platform through a movable stage.
* The movable node can move relative to the platform.

==Potential Applications==
This technology has potential applications in various fields, including:

* Testing and validation of thermal management systems in electronic devices.
* Research and development of materials with specific thermal properties.
* Calibration and verification of thermal sensors and instruments.
* Training and education in thermal engineering and heat transfer.

==Problems Solved==
The device solves several problems related to simulating thermal loads, such as:

* Providing a controlled and repeatable environment for testing thermal management systems.
* Allowing researchers to study the effects of different thermal conditions on materials and devices.
* Ensuring accurate calibration and verification of thermal sensors and instruments.
* Enhancing the understanding and knowledge of thermal engineering principles through practical demonstrations.

==Benefits==
The device offers several benefits over existing methods of simulating thermal loads, including:

* Increased flexibility and adjustability in creating specific thermal conditions.
* Improved accuracy and precision in testing and research.
* Time and cost savings by eliminating the need for complex and expensive setups.
* Enhanced educational opportunities through hands-on experimentation and visualization of thermal concepts.


==Original Abstract Submitted==

A device for simulating thermal loads includes a platform and a plurality of nodes supported by the platform. At least one node is a movable node connected to the platform by a movable stage to move the movable node relative to the platform.



[[Category:G01R31/28]]