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Category:Jun Zhai of Cupertino CA (US)
Pages in category "Jun Zhai of Cupertino CA (US)"
The following 19 pages are in this category, out of 19 total.
1
- 17932182. Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (Apple Inc.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18158090. Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract (Apple Inc.)
- 18339132. DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES simplified abstract (APPLE INC.)
- 18348934. MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES (Apple Inc.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18488561. Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology simplified abstract (Apple Inc.)
- 18585834. Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated Circuit (Apple Inc.)
- 18598938. Chip Singulation Assisted Structures and Methods for Improving Bonding Interface Quality (Apple Inc.)
- 18733580. Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device simplified abstract (Apple Inc.)
A
- Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Apple inc. (20240105626). Semiconductor Package with Local Interconnect and Chiplet Integration simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240249989). Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract
- Apple inc. (20240321833). Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device simplified abstract
- Apple inc. (20240421013). Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated Circuit
- Apple inc. (20240421126). Chip Singulation Assisted Structures and Methods for Improving Bonding Interface Quality