18733580. Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device simplified abstract (Apple Inc.)
Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device
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Inventor(s)
Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18733580 titled 'Fully Interconnected Heterogeneous Multi-layer Reconstructed Silicon Device
- Simplified Explanation:**
The patent application describes reconstructed 3DIC structures where each die can function as a communication bridge between two other dies/chiplets in addition to performing its core function.
- Key Features and Innovation:**
- Dies in each package level of a 3DIC can act as functional chips and stitching devices for adjacent dies. - Each die can serve as a communication bridge between other dies/chiplets. - Enables efficient communication and connectivity between different levels of the 3DIC structure.
- Potential Applications:**
- Advanced semiconductor manufacturing processes. - High-performance computing systems. - Communication and networking devices.
- Problems Solved:**
- Enhances connectivity and communication efficiency in 3DIC structures. - Optimizes the use of space and resources in semiconductor packaging.
- Benefits:**
- Improved performance and speed in data transfer. - Enhanced functionality and versatility of 3DIC structures. - Cost-effective and space-efficient semiconductor packaging solutions.
- Commercial Applications:**
Title: Advanced 3DIC Structures for Enhanced Communication and Connectivity This technology can be applied in the development of high-speed computing systems, networking devices, and advanced semiconductor products. It has the potential to revolutionize the semiconductor packaging industry by improving communication efficiency and connectivity in 3DIC structures.
- Questions about 3DIC Structures:**
1. How does this innovation impact the overall performance of semiconductor devices? 2. What are the potential cost savings associated with implementing this technology in semiconductor manufacturing processes?
Original Abstract Submitted
Reconstructed 3DIC structures and methods of manufacture are described. In an embodiment, one or more dies in each package level of a 3DIC are both functional chips and/or stitching devices for two or more dies in an adjacent package level. Thus, each die can function as a communication bridge between two other dies/chiplets in addition to performing a separate chip core function.
