There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H10N10/82
Subcategories
This category has the following 6 subcategories, out of 6 total.
A
H
J
M
W
Y
Pages in category "H10N10/82"
The following 14 pages are in this category, out of 14 total.
1
- 18152131. PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18464160. LOCKING DEVICE FORMED OF THERMALLY ADAPTIVE MULTI-METALLIC MATERIAL AND A THERMOELECTRIC JUNCTION AND METHOD OF MANUFACTURING THE SAME (Hamilton Sundstrand Corporation)
- 18728582. THERMOELECTRIC DEVICE (LG Innotek Co., Ltd.)
- 18809681. DUAL MANUFACTURING PROCESS AND CALIBRATION TO ACHIEVE HIGH ACCURACY THERMAL COUPLE SUBSTRATES (Applied Materials, Inc.)
- 18817456. Thermoelectric Flexible Composite Materials for Energy Harvesting from an Aircraft Environment and an Aircraft Manufacturing Environment (The Boeing Company)
- 18817456. Thermoelectric Flexible Composite Materials for Energy Harvesting from an Aircraft Environment and an Aircraft Manufacturing Environment (UNIVERSITY OF WASHINGTON)
A
H
T
- Taiwan semiconductor manufacturing co., ltd. (20240096740). PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024