There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H05K3/30
Subcategories
This category has the following 10 subcategories, out of 10 total.
B
C
K
S
T
W
Y
Pages in category "H05K3/30"
The following 41 pages are in this category, out of 41 total.
1
- 18048456. MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18093947. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING COUPLER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18130719. HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME simplified abstract (TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.)
- 18188297. ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT simplified abstract (Intel Corporation)
- 18264093. ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE (BOE TECHNOLOGY GROUP CO., LTD.)
- 18290744. FILTER, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS (BOE Technology Group Co., Ltd.)
- 18331759. SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT simplified abstract (CANON KABUSHIKI KAISHA)
- 18496869. MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD (Dell Products L.P.)
- 18550317. ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE simplified abstract (PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.)
- 18625500. SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18653496. ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18672524. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18701844. CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS (FUJI CORPORATION)
- 18718967. ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING APPARATUS (FUJI CORPORATION)
- 18751647. PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICONDUCTOR CHIP DEVICE (Infineon Technologies AG)
- 18889578. WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD (DAI NIPPON PRINTING CO., LTD.)
- 18968225. ELECTRONIC APPARATUS (LENOVO (SINGAPORE) PTE. LTD.)
5
B
D
I
- Intel corporation (20240324108). ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT simplified abstract
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240138064). MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract
- International business machines corporation (20240237210). MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on April 25th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 11th, 2024
M
S
- Samsung display co., ltd. (20240284594). ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract
- Samsung Display Co., LTD. patent applications on August 22nd, 2024
- Samsung electro-mechanics co., ltd. (20250126715). PRINTED CIRCUIT BOARD
- Samsung Electro-Mechanics Co., Ltd. patent applications on April 17th, 2025