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Category:H01L27/01
Subcategories
This category has the following 3 subcategories, out of 3 total.
B
C
Z
Pages in category "H01L27/01"
The following 50 pages are in this category, out of 50 total.
1
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17957847. GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18067703. STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)
- 18091607. HIGH-VOLTAGE BASED LOW-POWER, TEMPERATURE DEPENDENT, THIN-OXIDE ONLY ON-CHIP HIGH CURRENT LOW DROP OUT (LDO) REGULATOR simplified abstract (XILINX, INC.)
- 18149099. DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18177404. DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract (QUALCOMM Incorporated)
- 18333860. SUBSTRATES INCLUDING MICRO-STRUCTURED THIN FILM CAPACITORS (Intel Corporation)
- 18344564. TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18498188. PASSIVE COMPONENT MODULE simplified abstract (Texas Instruments Incorporated)
- 18508663. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18512092. 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18598486. TRANSFORMER ARRANGEMENT simplified abstract (Infineon Technologies Austria AG)
- 18616727. INTEGRATED CIRCUIT WITH TUNABLE CAPACITOR ARRAY (Apple Inc.)
- 18748008. NOVEL THIN FILM RESISTOR simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18980886. SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR (Taiwan Semiconductor Manufacturing Co., Ltd.)
A
I
- Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract
- Intel corporation (20240421144). SUBSTRATES INCLUDING MICRO-STRUCTURED THIN FILM CAPACITORS
- Intel corporation (20240429221). GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on December 26th, 2024
- Intel Corporation patent applications on June 27th, 2024
Q
- Qualcomm incorporated (20240105760). INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD simplified abstract
- Qualcomm incorporated (20240297165). DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on January 30th, 2025
- QUALCOMM Incorporated patent applications on March 28th, 2024
- QUALCOMM Incorporated patent applications on September 5th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20250112146). SEMICONDUCTOR DEVICE INCLUDING CAPACITOR AND RESISTOR
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 3rd, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240105707). Semiconductor Structures And Methods Of Forming The Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339448). NOVEL THIN FILM RESISTOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379646). SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- Texas instruments incorporated (20240113094). GALVANIC ISOLATION DEVICE simplified abstract
- Texas instruments incorporated (20240113095). STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract
- Texas instruments incorporated (20240113096). DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE simplified abstract
- Texas instruments incorporated (20240297112). PASSIVE COMPONENT MODULE simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
- Texas Instruments Incorporated patent applications on September 5th, 2024