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Category:H01L25/00
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Pages in category "H01L25/00"
The following 200 pages are in this category, out of 893 total.
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- 17383449. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17412625. Semiconductor Package And Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17460340. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17532754. PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17535664. MULTIPLE DIE ASSEMBLY simplified abstract (International Business Machines Corporation)
- 17568361. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17650758. Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated Circuits simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17656011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17669914. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17703700. METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17739618. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17746822. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17812966. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17821646. WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES simplified abstract (Micron Technology, Inc.)
- 17823189. DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER simplified abstract (Micron Technology, Inc.)
- 17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17825076. NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17847130. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)
- 17848246. MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS simplified abstract (Intel Corporation)
- 17862496. THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND A METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17884475. SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17886466. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887362. INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE simplified abstract (Micron Technology, Inc.)
- 17887372. REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE simplified abstract (Micron Technology, Inc.)
- 17893672. WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES simplified abstract (Micron Technology, Inc.)
- 17893941. SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 17894043. PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
- 17894095. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895502. PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17943104. TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE simplified abstract (Micron Technology, Inc.)
- 17949069. HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES simplified abstract (SanDisk Technologies LLC)
- 17956753. DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract (Intel Corporation)
- 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957483. INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 17961025. MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION simplified abstract (Micron Technology, Inc.)
- 17961954. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17968830. ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract (Intel Corporation)
- 17987823. STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17993240. Socket To Support High Performance Multi-die ASICs simplified abstract (Google LLC)
- 18049428. SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18052689. SEMICONDUCTOR MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18060853. Semiconductor Package with Multiple Redistribution Substrates simplified abstract (Samsung Electronics Co., Ltd.)
- 18066448. INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18075814. DIE ALIGNMENT METHOD USING MAGNETIC FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18076733. HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES simplified abstract (International Business Machines Corporation)
- 18078923. HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18080729. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)
- 18086575. CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract (International Business Machines Corporation)
- 18089459. ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18089488. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089495. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18090273. DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18090707. DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (Intel Corporation)
- 18091014. HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18091228. ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091265. DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091560. TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 18092081. CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRONIC DEVICES simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18092994. SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18093900. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18119784. SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18120910. INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS simplified abstract (Intel Corporation)
- 18121158. PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18122285. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18123402. DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18125348. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18138363. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18147858. METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18148945. PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES simplified abstract (Intel Corporation)
- 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150034. Packaged Memory Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151071. Package Formation Using UBM-First Approach and the Corresponding Packages simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151545. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151622. PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18152176. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152665. Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18156848. 3DIC STRUCTURE AND METHODS OF FORMING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18163416. STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18165772. Thermal Dissipation Structures and Methods for Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169177. PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18177404. DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract (QUALCOMM Incorporated)
- 18181950. DISCRETE DUAL PADS FOR A CIRCUIT simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18213851. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18215292. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18216632. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18216749. ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY (International Business Machines Corporation)
- 18218886. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18219394. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226990. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18233974. METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS (Yangtze Memory Technologies Co., Ltd.)
- 18234325. 3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION (Yangtze Memory Technologies Co., Ltd.)
- 18236607. METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18241592. FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH simplified abstract (MICRON TECHNOLOGY, INC.)
- 18244429. NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18299795. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18302023. PACKAGE INCLUDING COMPOSITE INTERPOSER AND/OR COMPOSITE PACKAGING SUBSTRATE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18303641. CHIP PACKAGE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18303659. SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18320013. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DEVIATION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18320138. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18328848. METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING simplified abstract (Samsung Electronics Co., Ltd.)
- 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18336413. MIM Capacitor in IC Heterogenous Integration (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18336775. DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-LEVEL-CACHE APPLICATIONS (QUALCOMM Incorporated)
- 18337040. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18337180. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18341490. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18343011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18343770. HIGH VOLTAGE POWER TRANSFER ON PRINTED CIRCUIT BOARD (Intel Corporation)
- 18351748. METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18351975. FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18353621. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18356682. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18357211. HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE simplified abstract (WESTERN DIGITAL TECHNOLOGIES, INC.)
- 18358727. THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION simplified abstract (SanDisk Technologies LLC)
- 18362688. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18367704. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368128. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18368302. Inductive Heatable Particles in Semiconductor Module (Infineon Technologies AG)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18370940. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18370949. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374718. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18375173. SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380325. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18380404. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18387682. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18390439. ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18393132. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (SK hynix Inc.)
- 18394974. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18395839. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18397891. MULTI-CHIP PACKAGING simplified abstract (Intel Corporation)
- 18400994. TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract (Micron Technology, Inc.)
- 18402611. SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18403011. BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM simplified abstract (CANON KABUSHIKI KAISHA)
- 18403022. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18403064. Semiconductor Device and Method (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18405844. STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18409547. INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
- 18419399. SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18421198. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18422220. DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18423166. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18426271. STACKED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18426282. STACKED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18426703. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18429039. FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18429471. METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18432353. PACKAGE STRUCTURE HAVING LINE CONNECTED VIA PORTIONS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435272. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (SK hynix Inc.)
- 18435628. UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY simplified abstract (Lodestar Licensing Group LLC)
- 18440172. DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18440297. PHOTONICS INTEGRATED CIRCUIT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18440774. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18441462. INTEGRATED CIRCUITS WITH SELECTABLE PACKAGING TYPES simplified abstract (Micron Technology, Inc.)
- 18443166. SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 18443338. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18443882. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18447528. HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18447581. DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18455558. DUAL SWITCHING POWER DEVICE (Texas Instruments Incorporated)
- 18458069. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18467979. INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18469946. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18471223. INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE (Texas Instruments Incorporated)
- 18474111. DIE PAIR DEVICE PARTITIONING simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474179. ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18478821. MICROELECTRONIC DEVICES, AND METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18482743. PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18483543. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18484571. PACKAGE STRUCTURE WITH UNDERFILL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18486950. SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR SWITCHABLE ROUTING simplified abstract (Micron Technology, Inc.)
- 18492402. PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)
- 18494109. Light Emitting Structure simplified abstract (Apple Inc.)
