17895502. PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Jump to navigation
Jump to search
PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wen-Shiang Liao of Toufen Township (TW)
PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17895502 titled 'PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION
Simplified Explanation
- Device and method for integrating a receive transmit integrated circuit die and embedded antenna
- Oscillation region aligned to embedded antenna with a cavity in the substrate for RF signal passage
- Simplified explanation: A device and method for integrating a circuit die and antenna with a cavity for RF signal passage
Potential Applications
- Wireless communication devices
- Internet of Things (IoT) devices
- RFID technology
Problems Solved
- Integration of circuit die and antenna
- Efficient RF signal transmission and reception
Benefits
- Compact design
- Improved signal quality
- Cost-effective solution
Original Abstract Submitted
Embodiments provide an integrated package device and method of forming the same, the device including a receive transmit integrated circuit die and embedded antenna. An oscillation region is aligned to the embedded antenna and a cavity is provided in the substrate to allow the passage of radio frequency (RF) signals into and out of the oscillation region.