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Category:H01L23/373
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Pages in category "H01L23/373"
The following 200 pages are in this category, out of 306 total.
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- 17455949. DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS simplified abstract (International Business Machines Corporation)
- 17703057. METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE simplified abstract (HYUNDAI MOTOR COMPANY)
- 17703057. METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE simplified abstract (KIA CORPORATION)
- 17746990. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17808705. Semiconductor Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17809039. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17873170. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17874400. ELECTRODE STRUCTURE INCLUDING METAL AND HEAT DISSIPATION LAYER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17876558. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17886466. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17962434. ISOLATING HEAT SPREADER simplified abstract (International Business Machines Corporation)
- 17993252. DISPLAY DEVICE AND MANUFACTURING METHOD FOR THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- 18122895. Embedded Package with Shielding Pad simplified abstract (Infineon Technologies AG)
- 18140343. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18144637. POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (HYUNDAI MOTOR COMPANY)
- 18144637. POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (KIA CORPORATION)
- 18150379. POWER MODULE THERMAL MANAGEMENT simplified abstract (GM Global Technology Operations LLC)
- 18150406. COOLED POWER MODULE simplified abstract (GM Global Technology Operations LLC)
- 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18158305. SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD FOR SEMICONDUCTOR STRUCTURE simplified abstract (Huawei Technologies Co., Ltd.)
- 18167081. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18170933. ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18173033. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18176695. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18180024. THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18182879. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (Intel Corporation)
- 18186656. METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION simplified abstract (Applied Materials, Inc.)
- 18197998. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18217049. METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES (Intel Corporation)
- 18244474. ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18268333. COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING COMPOSITE MATERIAL simplified abstract (Sumitomo Electric Industries, Ltd.)
- 18299368. BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS simplified abstract (HONEYWELL INTERNATIONAL INC.)
- 18299896. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18301367. THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract (International Business Machines Corporation)
- 18346674. SEMICONDUCTOR DIE STACK STRUCTURE simplified abstract (SK hynix Inc.)
- 18357211. HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE simplified abstract (WESTERN DIGITAL TECHNOLOGIES, INC.)
- 18357484. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18366098. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18367896. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18379286. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)
- 18399205. MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE simplified abstract (Intel Corporation)
- 18403864. CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18420135. WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18425703. POWER CONVERTER APPARATUS simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18464511. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18468174. Packaged Device, Packaged Module, and Power Conversion Device simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18468362. PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18469014. THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18471069. PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE (QUALCOMM Incorporated)
- 18510056. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
- 18514862. MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME simplified abstract (HYUNDAI MOTOR COMPANY)
- 18514862. MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME simplified abstract (KIA CORPORATION)
- 18522601. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526098. ELECTRICAL AND/OR ELECTRONIC DEVICE simplified abstract (Robert Bosch GmbH)
- 18526697. SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18531070. POWER MODULE FOR A VEHICLE simplified abstract (Robert Bosch GmbH)
- 18543819. 3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18550726. SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18553151. INTEGRATION OF BORON ARSENIDE INTO POWER DEVICES AND SEMICONDUCTORS FOR THERMAL MANAGEMENT simplified abstract (The Regents of the University of California)
- 18576203. POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18603047. ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18605034. THERMALLY REGULATED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18609255. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18622153. POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract (ROHM CO., LTD.)
- 18626787. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18634198. Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract (GOOGLE LLC)
- 18634630. DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME simplified abstract (Robert Bosch GmbH)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18647287. SEMICONDUCTOR DEVICE AND POWER CONVERTER simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18652365. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18653734. CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE CHIP BONDING FILM (SAMSUNG ELECTRONICS CO., LTD.)
- 18661684. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF (InnoLux Corporation)
- 18665942. CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18667009. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18674006. THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract (Texas Instruments Incorporated)
- 18674664. SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION (Micron Technology, Inc.)
- 18719482. SEMICONDUCTOR DEVICE (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18726482. THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR APPARATUS (Shin-Etsu Chemical Co., Ltd.)
- 18726934. A HEAT SPREADER, AND AN ELECTRONIC MODULE (Telefonaktiebolaget LM Ericsson (publ))
- 18745638. SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18783104. SEMICONDUCTOR DEVICE (FUJI ELECTRIC CO., LTD.)
- 18794640. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18816500. POWER MODULE AND METHOD OF FABRICATING THE SAME (Infineon Technologies AG)
- 18882385. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18883851. GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS (Intel Corporation)
- 18945445. POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHODS FOR INTEGRATED CIRCUIT PACKAGING (Murata Manufacturing Co., Ltd.)
- 18945966. SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18957303. SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18963083. SEMICONDUCTOR DEVICE (Murata Manufacturing Co., Ltd.)
- 18964045. SEMICONDUCTOR MODULE (Murata Manufacturing Co., Ltd.)
- 18969067. THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME (Google LLC)
A
B
D
- Delphi technologies ip limited (20240105533). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240105534). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240106354). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
G
- Gm global technology operations llc (20240234238). POWER MODULE THERMAL MANAGEMENT simplified abstract
- Gm global technology operations llc (20240234239). COOLED POWER MODULE simplified abstract
- GM Global Technology Operations LLC patent applications on July 11th, 2024
- Google llc (20240347414). Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract
- Google llc (20250092296). THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME
- Google LLC patent applications on March 20th, 2025
- GOOGLE LLC patent applications on October 17th, 2024
H
- Honeywell international inc. (20240347386). BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS simplified abstract
- HONEYWELL INTERNATIONAL INC. patent applications on October 17th, 2024
- Huawei technologies co., ltd. (20240274688). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLIFICATION CIRCUIT, AND ELECTRONIC DEVICE simplified abstract
- Huawei Technologies Co., Ltd. patent applications on August 15th, 2024
- Hyundai motor company (20240096737). MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME simplified abstract
- Hyundai motor company (20240120269). POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
- HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
- Hyundai Motor Company patent applications on February 29th, 2024
- HYUNDAI MOTOR COMPANY patent applications on March 21st, 2024
- Hyundai Motor Company patent applications on March 6th, 2025
I
- Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract
- Intel corporation (20240178097). PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract
- Intel corporation (20240234245). SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract
- Intel corporation (20240290680). LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME simplified abstract
- Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract
- Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract
- Intel corporation (20240332125). 2D FILLERS FOR REDUCED CTE FOR PID simplified abstract
- Intel corporation (20240332126). THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS simplified abstract
- Intel corporation (20240379495). STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MATERIALS simplified abstract
- Intel corporation (20240413031). ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Intel corporation (20250006570). GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Intel corporation (20250006643). METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on August 29th, 2024
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on February 29th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on January 30th, 2025
- Intel Corporation patent applications on July 11th, 2024
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on November 14th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- Intel Corporation patent applications on September 19th, 2024
- International business machines corporation (20240332121). ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES simplified abstract
- International business machines corporation (20240347497). THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract
- International Business Machines Corporation patent applications on April 11th, 2024
- International Business Machines Corporation patent applications on October 17th, 2024
- International Business Machines Corporation patent applications on October 3rd, 2024
K
M
- Micron technology, inc. (20240339437). SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME simplified abstract
- Micron technology, inc. (20240347413). THERMALLY REGULATED SEMICONDUCTOR DEVICE simplified abstract
- Micron technology, inc. (20240347418). MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER simplified abstract
- Micron technology, inc. (20240421030). SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION
- Micron Technology, Inc. patent applications on December 19th, 2024
- Micron Technology, Inc. patent applications on October 10th, 2024
- Micron Technology, Inc. patent applications on October 17th, 2024
- Mitsubishi electric corporation (20240234237). POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on February 13th, 2025
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
- Murata manufacturing co., ltd. (20250070102). POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHODS FOR INTEGRATED CIRCUIT PACKAGING
- Murata manufacturing co., ltd. (20250087552). SEMICONDUCTOR DEVICE
- Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
- Murata Manufacturing Co., Ltd. patent applications on March 13th, 2025
Q
- Qualcomm incorporated (20240096817). ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract
- Qualcomm incorporated (20240274516). INTERPOSER WITH SOLDER RESIST POSTS simplified abstract
- Qualcomm incorporated (20250096051). PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE
- QUALCOMM Incorporated patent applications on August 15th, 2024
- QUALCOMM Incorporated patent applications on March 20th, 2025
- QUALCOMM Incorporated patent applications on March 21st, 2024
R
- Robert bosch gmbh (20240194576). POWER MODULE FOR A VEHICLE simplified abstract
- Robert bosch gmbh (20240347417). DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME simplified abstract
- Robert Bosch GmbH patent applications on June 13th, 2024
- Robert Bosch GmbH patent applications on October 17th, 2024
- Rohm co., ltd. (20240282675). POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract
- Rohm co., ltd. (20240282692). SEMICONDUCTOR DEVICE simplified abstract
- ROHM CO., LTD. patent applications on August 22nd, 2024
S
- Samsung display co., ltd. (20240215420). ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung Display Co., LTD. patent applications on June 27th, 2024
- Samsung electronics co., ltd. (20240105541). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120263). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128155). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240162111). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract
