There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01L23/367
Jump to navigation
Jump to search
(previous page) (next page)
Subcategories
This category has the following 102 subcategories, out of 102 total.
A
C
D
E
F
H
I
J
K
L
M
N
P
R
S
T
V
W
X
Y
Pages in category "H01L23/367"
The following 200 pages are in this category, out of 492 total.
(previous page) (next page)1
- 17455949. DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS simplified abstract (International Business Machines Corporation)
- 17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
- 17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17703700. METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17729734. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17746990. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17747131. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17806532. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17808705. Semiconductor Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17809039. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17822470. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17843967. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
- 17862459. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17872473. CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY simplified abstract (Huawei Technologies Co., Ltd.)
- 17873170. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17874192. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17874404. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
- 17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)
- 17884695. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17885022. Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package simplified abstract (GOOGLE LLC)
- 17886466. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17892252. FILM PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17896097. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17900785. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
- 17936937. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17950175. SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY AND SUBSTRATE EMBEDDED POWERGRID APPROACH simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17962434. ISOLATING HEAT SPREADER simplified abstract (International Business Machines Corporation)
- 17972923. COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (Intel Corporation)
- 17983145. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18034133. TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES simplified abstract (Intel Corporation)
- 18065365. HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL simplified abstract (International Business Machines Corporation)
- 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)
- 18090883. PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (Intel Corporation)
- 18092136. HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18099663. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18140343. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149990. HEAT SINK WITH TURBULENT STRUCTURES simplified abstract (Google LLC)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18154329. SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18154919. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18167081. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169662. Electromagnetic Interference Shield with Thermal Conductivity simplified abstract (Apple Inc.)
- 18169998. INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER simplified abstract (International Business Machines Corporation)
- 18175947. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18176695. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226866. QUANTUM DEVICE simplified abstract (NEC Corporation)
- 18229039. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18229824. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18235643. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18244350. INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18274747. Power Semiconductor Device simplified abstract (HITACHI ASTEMO, LTD.)
- 18284861. PRINTED CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18290289. ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING SIDE I/OS (Intel Corporation)
- 18320456. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- 18340101. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18343011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18357646. SEMICONDUCTOR POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18367896. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18379286. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380424. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380854. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18391891. CHIP PACKAGE WITH LID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)
- 18397389. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18398043. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18402558. STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED FOR THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18402883. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18402916. POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18403686. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18414292. BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE simplified abstract (NVIDIA Corporation)
- 18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18423166. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18430903. CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18435107. ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE CHANGE MATERIAL simplified abstract (Samsung Electronics Co., Ltd.)
- 18453713. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18457535. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18459771. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18464075. POWER CONVERSION APPARATUS simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18468174. Packaged Device, Packaged Module, and Power Conversion Device simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18474166. BACKSIDE POWER simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18483281. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 18483870. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18488710. SEMICONDUCTOR MODULE simplified abstract (Robert Bosch GmbH)
- 18491637. FILTERING STRUCTURE AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18497672. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18510599. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18522601. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18523255. LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL simplified abstract (HONEYWELL INTERNATIONAL INC.)
- 18526098. ELECTRICAL AND/OR ELECTRONIC DEVICE simplified abstract (Robert Bosch GmbH)
- 18530542. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18550726. SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18554244. SEMICONDUCTOR DEVICE simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18556265. POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18559153. Electronic Control Device simplified abstract (Hitachi Astemo, Ltd.)
- 18582494. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583411. THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18584148. ELECTRONIC DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18596076. Asic Package With Photonics And Vertical Power Delivery simplified abstract (Google LLC)
- 18596641. SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHODS OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18615907. THERMAL RESISTOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18617896. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18619037. HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18635894. ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS simplified abstract (Intel Corporation)
- 18637489. AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND CONNECTIONS simplified abstract (NXP USA, Inc.)
- 18639595. HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652365. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652417. SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MOUNTING BODY simplified abstract (ROHM CO., LTD.)
- 18653619. POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18655903. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (Samsung Electronics Co., Ltd.)
- 18669914. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18674006. THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract (Texas Instruments Incorporated)
- 18676343. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18724460. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (Mitsubishi Electric Corporation)
- 18729548. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18741160. ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME (InnoLux Corporation)
- 18747798. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18748127. ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18751036. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18751061. THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18751724. CHIP PACKAGE STRUCTURE WITH LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18763599. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18794640. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18816500. POWER MODULE AND METHOD OF FABRICATING THE SAME (Infineon Technologies AG)
- 18816812. SEMICONDUCTOR MODULE (FUJI ELECTRIC CO., LTD.)
- 18823149. SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE (Fujitsu Limited)
- 18823279. COOLER AND SEMICONDUCTOR MODULE (ROHM CO., LTD.)
- 18882385. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18883759. METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION (Intel Corporation)
- 18884004. SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT (Kioxia Corporation)
- 18887368. SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTERFACES (Intel Corporation)
- 18942893. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER (SAMSUNG ELECTRONICS CO., LTD.)
- 18943337. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18943420. MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS (Intel Corporation)
- 18945312. POWER MODULES AND METHODS FOR ASSEMBLING POWER MODULES (Murata Manufacturing Co., Ltd.)
- 18946959. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18955613. IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SPREADER (Intel Corporation)
- 18955994. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18956164. INTEGRATED CIRCUIT STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18957303. SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18961355. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18964045. SEMICONDUCTOR MODULE (Murata Manufacturing Co., Ltd.)
- 18964984. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18966367. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18969889. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (Intel Corporation)
2
- 20240014101. MICROFLUIDIC CHANNELS SEALED WITH DIRECTIONALLY-GROWN PLUGS simplified abstract (GlobalFoundries U.S. Inc.)
- 20240030088. HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE simplified abstract (STATS ChipPAC Pte. Ltd.)
- 20240055310. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 20240055393. PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS simplified abstract (Invensas LLC)
A
- Advanced micro devices, inc. (20250006496). REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID OUTSIDE OF AN AREA CONTACTING A DIE
- Advanced Micro Devices, Inc. patent applications on January 2nd, 2025
- Apple Inc. patent applications on February 29th, 2024
- Apple Inc. patent applications on February 6th, 2025
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on May 16th, 2024
C
D
- Dell Products L.P. patent applications on January 25th, 2024
- Delphi technologies ip limited (20240105553). SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS simplified abstract
- Delphi technologies ip limited (20240107718). SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE simplified abstract
G
- Google llc (20240186214). Three Dimensional IC Package with Thermal Enhancement simplified abstract
- Google llc (20240213215). Asic Package With Photonics And Vertical Power Delivery simplified abstract
- GOOGLE LLC patent applications on February 15th, 2024
- GOOGLE LLC patent applications on February 1st, 2024
- Google LLC patent applications on June 27th, 2024