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Category:H01L23/06
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This category has only the following subcategory.
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Pages in category "H01L23/06"
The following 12 pages are in this category, out of 12 total.
1
- 18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18072026. Slot Bow-Tie Antenna On Package simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18284068. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18557785. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18671330. SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18891287. Packaged Integrated Circuit Device Having A Deformable Lid, And Associated Methods (NXP USA, INC.)
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- Taiwan semiconductor manufacturing co., ltd. (20240312851). SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Texas instruments incorporated (20240178163). Slot Bow-Tie Antenna On Package simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on May 30th, 2024