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Category:H01L21/3065
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Pages in category "H01L21/3065"
The following 200 pages are in this category, out of 230 total.
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- 17548913. NANOSHEET DEVICE WITH VERTICAL BLOCKER FIN simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17592995. Fin Field-Effect Transistor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17679537. CHAMBER WALL POLYMER PROTECTION SYSTEM AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836452. SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17837958. METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR SUBSTRATE IN A PLASMA ETCH CHAMBER simplified abstract (Applied Materials, Inc.)
- 17865773. PLASMA EDGE RING, PLASMA ETCHING APPARATUS INCLUDING THE SAME, AND PLASMA ETCHING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17938344. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17943751. HEIGHT CONTROL IN NANOSHEET DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17963687. ISOTROPIC SILICON NITRIDE REMOVAL simplified abstract (Applied Materials, Inc.)
- 17969333. SELECTIVE TRENCH MODIFICATION USING DIRECTIONAL ETCH simplified abstract (Applied Materials, Inc.)
- 17970899. Polymer Removal via Multiple Flash Steps during Plasma Etch simplified abstract (Tokyo Electron Limited)
- 18086150. Silicon (Si) Dry Etch for Die-to-Wafer Thinning simplified abstract (Applied Materials, Inc.)
- 18091188. ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract (Intel Corporation)
- 18097265. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18133276. POWER DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18151223. Method for Etching Features in a Layer in a Substrate simplified abstract (Tokyo Electron Limited)
- 18151643. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152626. Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18164117. PLASMA ETCH SYSTEM INCLUDING TUNABLE PLASMA SHEATH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169573. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171119. SILICON SUPER JUNCTION STRUCTURES FOR INCREASED THROUGHPUT simplified abstract (Applied Materials, Inc.)
- 18208530. PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18210328. ELECTROSTATIC SUBSTRATE SUPPORT (Applied Materials, Inc.)
- 18233486. SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18236748. EDGE RING, DRY ETCHING APPARATUS HAVING THE SAME, AND OPERATION METHOD OF ETCHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18240008. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18297282. TRENCH CAPACITOR STRUCTURE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18335642. SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS (SAUDI ARABIAN OIL COMPANY)
- 18337281. METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES (Tokyo Electron Limited)
- 18348064. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18356776. HIGH PERFORMANCE FETS (SAMSUNG ELECTRONICS CO., LTD.)
- 18357725. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18370268. SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18389827. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18411667. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18433217. INTEGRATED CIRCUIT DEVICE WITH SOURCE/DRAIN BARRIER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18434121. Semiconductor Patterning and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18447580. MULTI-SILICIDE STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18449452. SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE simplified abstract (Western Digital Technologies, Inc.)
- 18452004. SEMICONDUCTOR FIN CUT PROCESS AND STRUCTURES FORMED THEREBY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18458122. INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18458122. INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18469208. METHODS OF PROCESSING SUBSTRATES AND APPARATUSES THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18494759. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18511711. EPITAXIAL FIN STRUCTURES OF FINFET HAVING AN EPITAXIAL BUFFER REGION AND AN EPITAXIAL CAPPING REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516408. Fin Loss Prevention simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517565. A SEMICONDUCTOR DEVICE FOR RECESSED FIN STRUCTURE HAVING ROUNDED CORNERS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18521913. FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18525473. Semiconductor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18526062. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18531359. ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract (Intel Corporation)
- 18542776. SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS simplified abstract (SEMES CO., LTD.)
- 18581096. SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18581182. SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18584282. SOURCE/DRAIN EPITAXIAL LAYER PROFILE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18584540. DIRECTIONAL SELECTIVE FILL USING HIGH DENSITY PLASMA simplified abstract (Applied Materials, Inc.)
- 18586372. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18587477. Methods for Forming Stacked Layers and Devices Formed Thereof simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18590179. METHODS OF FORMING SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18591923. GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598781. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18599374. FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND ELECTRONIC CIRCUIT simplified abstract (Huawei Technologies Co., Ltd.)
- 18603360. SELECTIVE OXIDATION PROCESSES FOR GATE-ALL-AROUND TRANSISTORS simplified abstract (Applied Materials, Inc.)
- 18603584. ETCHING METHOD, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18609639. FINFET CIRCUIT DEVICES WITH WELL ISOLATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18609875. METHOD FOR FORMING A CRYSTALLINE PROTECTIVE POLYSILICON LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18616832. METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN STRUCTURE HAVING MODIFIED SHAPE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18637874. SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18670123. SEMICONDUCTOR DEVICE HAVING FINS AND METHOD OF FABRICATING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674285. MULTI-GATE DEVICE FABRICATION AND STRUCTURES THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18725503. HIGH SELECTIVITY AND UNIFORM DIELECTRIC ETCH (Lam Research Corporation)
- 18732053. SYSTEMS FOR PROCESSING ONE OR MORE SEMICONDUCTOR DEVICES, AND RELATED METHODS simplified abstract (Micron Technology, Inc.)
- 18745323. SEMICONDUCTOR DEVICE ACTIVE REGION PROFILE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751859. METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES (Tokyo Electron Limited)
- 18755306. METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract (Intel Corporation)
- 18896372. ETCHING METHOD (Hitachi High-Tech Corporation)
- 18938789. SEMICONDUCTOR DEVICE AND METHODS OF FORMATION (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18940332. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (Kioxia Corporation)
- 18954712. APPARATUS, SYSTEMS, AND METHODS OF USING ATOMIC HYDROGEN RADICALS WITH SELECTIVE EPITAXIAL DEPOSITION (Applied Materials, Inc.)
- 18956509. CONTACT RESISTANCE REDUCTION FOR TRANSISTORS (Taiwan Semiconductor Manufacturing Co., Ltd.)
2
A
- Applied materials, inc. (20240266152). PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS simplified abstract
- Applied materials, inc. (20240266180). ENHANCED ETCH SELECTIVITY USING HALIDES simplified abstract
- Applied materials, inc. (20240266220). INTEGRATED LASER AND PLASMA ETCH DICING simplified abstract
- Applied materials, inc. (20240282813). SILICON SUPER JUNCTION STRUCTURES FOR INCREASED THROUGHPUT simplified abstract
- Applied materials, inc. (20240420984). ELECTROSTATIC SUBSTRATE SUPPORT
- Applied materials, inc. (20250087485). APPARATUS, SYSTEMS, AND METHODS OF USING ATOMIC HYDROGEN RADICALS WITH SELECTIVE EPITAXIAL DEPOSITION
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 20th, 2025
- Applied Materials, Inc. patent applications on February 6th, 2025
- Applied Materials, Inc. patent applications on January 23rd, 2025
- Applied Materials, Inc. patent applications on March 13th, 2025
B
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on March 7th, 2024
H
I
- Intel corporation (20240120206). ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract
- Intel corporation (20240222136). ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract
- Intel corporation (20240290789). TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SINGLE DIE simplified abstract
- Intel corporation (20240347590). METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on August 29th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on October 17th, 2024
- International Business Machines Corporation patent applications on February 6th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 14th, 2024
K
- Kabushiki kaisha toshiba (20240321779). INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
- Kioxia corporation (20240312801). SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia Corporation patent applications on September 19th, 2024
M
N
S
- Samsung electronics co., ltd. (20240096637). SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240096944). POWER DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240120177). SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240120213). SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240157481). SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract
- Samsung electronics co., ltd. (20240355637). METHOD FOR FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240412958). PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20240413232). HIGH PERFORMANCE FETS
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Samsung electronics co., ltd.. (20240105457). SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Saudi arabian oil company (20240421104). SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- SAUDI ARABIAN OIL COMPANY patent applications on December 19th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096930). TRENCH CAPACITOR STRUCTURE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194537). SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194749). SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194784). SOURCE/DRAIN EPITAXIAL LAYER PROFILE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222188). FINFET CIRCUIT DEVICES WITH WELL ISOLATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222197). METHOD FOR FORMING A CRYSTALLINE PROTECTIVE POLYSILICON LAYER simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222292). Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250123). GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250155). METHODS OF FORMING SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312788). SEMICONDUCTOR FIN CUT PROCESS AND STRUCTURES FORMED THEREBY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240313090). MULTI-GATE DEVICE FABRICATION AND STRUCTURES THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087491). CONTACT RESISTANCE REDUCTION FOR TRANSISTORS
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105751). SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112905). Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113112). Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113221). FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120207). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120272). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240177995). Semiconductor Patterning and Resulting Structures simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178271). INTEGRATED CIRCUIT DEVICE WITH SOURCE/DRAIN BARRIER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213314). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213344). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234210). INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234548). METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN STRUCTURE HAVING MODIFIED SHAPE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243011). Methods for Forming Stacked Layers and Devices Formed Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258174). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240260249). Memory Device with Improved Margin and Performance and Methods of Formation Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266179). PLASMA ETCH SYSTEM INCLUDING TUNABLE PLASMA SHEATH simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266439). SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290854). High Selectivity Etching With Germanium-Containing Gases simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339541). SEMICONDUCTOR DEVICE ACTIVE REGION PROFILE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379373). HIGH ASPECT RATIO BOSCH DEEP ETCH simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379374). SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379439). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379754). SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379862). SEMICONDUCTOR DEVICE STRUCTURE WITH EMBEDDED EPITAXIAL STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250006561). STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHODS FOR FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250015166). SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING
- Taiwan semiconductor manufacturing company, ltd. (20250063777). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing company, ltd. (20250069893). SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
