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Category:Dilan Seneviratne of Phoenix AZ (US)
Pages in category "Dilan Seneviratne of Phoenix AZ (US)"
The following 14 pages are in this category, out of 14 total.
1
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 17955689. LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract (Intel Corporation)
- 17957637. POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract (Intel Corporation)
- 18059993. METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE simplified abstract (Intel Corporation)
- 18091270. IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract (Intel Corporation)
- 18148598. STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18217056. FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY (Intel Corporation)
I
- Intel corporation (20240105476). SYSTEM FOR COATING METHOD simplified abstract
- Intel corporation (20240112999). LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract
- Intel corporation (20240113009). POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract
- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract
- Intel corporation (20240173953). METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE simplified abstract
- Intel corporation (20240222211). IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract
- Intel corporation (20240222295). STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract