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Category:Darko Grujicic of Chandler AZ (US)
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This category has the following 2 subcategories, out of 2 total.
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Pages in category "Darko Grujicic of Chandler AZ (US)"
The following 25 pages are in this category, out of 25 total.
1
- 17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)
- 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- 18089471. THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)
- 18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation)
- 18092012. GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract (Intel Corporation)
- 18121264. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18121331. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation)
- 18189782. PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
- 18216525. THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES (Intel Corporation)
- 18217123. SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER (Intel Corporation)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation)
I
- Intel corporation (20240188222). METHOD OF FORMING A PACKAGE SUBSTRATE simplified abstract
- Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract
- Intel corporation (20240213301). THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract
- Intel corporation (20240222035). PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract
- Intel corporation (20240222258). GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract
- Intel corporation (20240312853). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240312888). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240321657). PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Intel corporation (20240327201). MEMS DIES EMBEDDED IN GLASS CORES simplified abstract
- Intel corporation (20240331921). ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS simplified abstract
- Intel corporation (20240332153). DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION simplified abstract