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Category:CPC H01L23/5283
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Pages in category "CPC H01L23/5283"
The following 200 pages are in this category, out of 259 total.
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- 18073119. Wire Structure for Low Resistance Interconnects simplified abstract (International Business Machines Corporation)
- 18094507. SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDEWALL AND METHOD FOR PREPARING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18125440. ISOLATED BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract (Intel Corporation)
- 18125455. BRIDGING CONTACT STRUCTURES simplified abstract (Intel Corporation)
- 18132418. SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18147820. HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES simplified abstract (Intel Corporation)
- 18171795. SUBTRACTIVE METAL VIA WITH METAL BRIDGE simplified abstract (International Business Machines Corporation)
- 18179417. LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18179421. WIRING STRUCTURE FOR ADVANCED INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18189850. TUNABLE W-SHAPED PROFILE FOR STRUCTURES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18234042. SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18239504. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEMS INCLUDING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18333863. REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18334414. INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18346999. TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES (International Business Machines Corporation)
- 18358702. THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION simplified abstract (SanDisk Technologies LLC)
- 18363000. NON-VOLATILE MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18380330. SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDEWALL AND METHOD FOR PREPARING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18382661. SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18403259. SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PROTECTIVE LAYER AND OUTER PROTECTIVE LAYER simplified abstract (Samsung Electronics Co., Ltd.)
- 18405362. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18417847. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18420074. CHOPLESS FLOW FOR STAIRLESS ELECTRICAL INTERCONNECT STRUCTURE simplified abstract (Micron Technology, Inc.)
- 18427720. MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18438167. HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18457907. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18469618. METAL TIP-TO-TIP SCALING (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18502563. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18508757. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18519551. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18527687. WIRING STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18587425. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18588565. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18593582. SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18596742. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18600031. SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18601745. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18612137. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18631666. MEMORY DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18634325. SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18645765. INTEGRATED CIRCUIT DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18650157. METALLIZATION LAYER AND FABRICATION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18650288. INTEGRATED CIRCUIT DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18651142. SEMICONDUCTOR MEMORY DEVICES (SAMSUNG ELECTRONICS CO., LTD.)
- 18652067. SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18662042. SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18663381. SEMICONDUCTOR DEVICES (Samsung Electronics Co., Ltd.)
- 18666962. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME (Samsung Electronics Co., Ltd.)
- 18668042. MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES simplified abstract (Intel Corporation)
- 18677693. MEMORY DEVICES INCLUDING SLOT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18731176. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM (Samsung Electronics Co., Ltd.)
- 18731590. BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18735195. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (Kioxia Corporation)
- 18743037. SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE (Kioxia Corporation)
- 18749812. INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18750571. PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED INTERCONNECT BRIDGE simplified abstract (Intel Corporation)
- 18760040. SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR STORAGE DEVICE (Kioxia Corporation)
- 18808257. SEMICONDUCTOR DEVICE (Kioxia Corporation)
- 18811335. SEMICONDUCTOR MEMORY DEVICE (Kioxia Corporation)
- 18892906. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME (Samsung Electronics Co., Ltd.)
- 18897275. SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT OF MULTILAYER WIRING STRUCTURES (Samsung Electronics Co., Ltd.)
- 18943866. METHOD OF FORMING MEMORY DEVICE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18944386. SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS (NANYA TECHNOLOGY CORPORATION)
- 18962181. THREE-DIMENSIONAL SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
B
I
- IMEC VZW Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240222274). HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES simplified abstract
- Intel corporation (20240304549). MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES simplified abstract
- Intel corporation (20240321737). ISOLATED BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract
- Intel corporation (20240321738). BRIDGING CONTACT STRUCTURES simplified abstract
- Intel corporation (20240332175). BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE simplified abstract
- Intel corporation (20240347457). PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240429164). INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on December 26th, 2024
- Intel Corporation patent applications on February 6th, 2025
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on October 17th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- Intel Corporation patent applications on September 12th, 2024
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240282704). SUBTRACTIVE METAL VIA WITH METAL BRIDGE simplified abstract
- International business machines corporation (20240290713). PASS-THROUGH WIRING IN NOTCHED INTERCONNECT simplified abstract
- International business machines corporation (20240304546). LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE simplified abstract
- International business machines corporation (20240304547). WIRING STRUCTURE FOR ADVANCED INTERCONNECT simplified abstract
- International business machines corporation (20240421078). REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- International business machines corporation (20240421079). INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- International business machines corporation (20250014994). TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- International business machines corporation (20250096132). METAL TIP-TO-TIP SCALING
- International Business Machines Corporation patent applications on August 22nd, 2024
- International Business Machines Corporation patent applications on August 29th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on December 19th, 2024
- International Business Machines Corporation patent applications on February 13th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on January 30th, 2025
- International Business Machines Corporation patent applications on January 9th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 20th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 12th, 2024
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) Patent Application Trends in 2024
K
- Kioxia corporation (20240304548). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240312911). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240321743). SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240421083). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Kioxia corporation (20240421084). SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE
- Kioxia Corporation Patent Application Trends in 2024
- Kioxia Corporation patent applications on December 19th, 2024
- Kioxia Corporation patent applications on September 12th, 2024
- Kioxia Corporation patent applications on September 19th, 2024
- Kioxia Corporation patent applications on September 26th, 2024
M
- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2024
- Micron technology, inc. (20240250024). CHOPLESS FLOW FOR STAIRLESS ELECTRICAL INTERCONNECT STRUCTURE simplified abstract
- Micron technology, inc. (20240321741). MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract
- Micron technology, inc. (20240321745). MEMORY DEVICES INCLUDING SLOT STRUCTURES simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- Micron Technology, Inc. patent applications on February 20th, 2025
- Micron Technology, Inc. patent applications on February 6th, 2025
- Micron Technology, Inc. patent applications on January 23rd, 2025
- Micron Technology, Inc. patent applications on January 30th, 2025
- Micron Technology, Inc. patent applications on July 25th, 2024
- Micron Technology, Inc. patent applications on September 26th, 2024
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Murata manufacturing co., ltd. (20240413083). SEMICONDUCTOR DEVICE
- Murata Manufacturing Co., Ltd. patent applications on December 12th, 2024
N
- Nanya technology corporation (20240347450). SEMICONDUCTOR DEVICE WITH ASSISTING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract
- Nanya technology corporation (20240347451). INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Nanya technology corporation (20240347453). SEMICONDUCTOR DEVICE WITH ASSISTING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract
- Nanya technology corporation (20240347454). INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- NANYA TECHNOLOGY CORPORATION patent applications on October 17th, 2024
- NVIDIA Corporation Patent Application Trends in 2024
- Nvidia Patent Application Trends in 2024
Q
R
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194595). SEMICONDUCTOR DEVICES simplified abstract
- Samsung electronics co., ltd. (20240194597). WIRING STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203875). SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEMS INCLUDING A SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240213155). SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240222275). NON-VOLATILE MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240234315). SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PROTECTIVE LAYER AND OUTER PROTECTIVE LAYER simplified abstract
- Samsung electronics co., ltd. (20240266287). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240282705). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240282706). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240297117). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321744). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240339403). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240347455). SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240355735). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240379545). SEMICONDUCTOR DEVICES simplified abstract
- Samsung electronics co., ltd. (20240404947). SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE STRUCTURES
- Samsung electronics co., ltd. (20240413081). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20240421080). HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20240421081). MEMORY DEVICE
- Samsung electronics co., ltd. (20240421082). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20240429165). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250006636). SEMICONDUCTOR MEMORY DEVICES
- Samsung electronics co., ltd. (20250014995). SEMICONDUCTOR DEVICES
- Samsung electronics co., ltd. (20250014997). SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Samsung electronics co., ltd. (20250014998). SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT OF MULTILAYER WIRING STRUCTURES
- Samsung electronics co., ltd. (20250022797). INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THROUGH DIFFERENT PROCESSES
- Samsung electronics co., ltd. (20250022798). SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250022799). SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Samsung electronics co., ltd. (20250062228). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250062229). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Samsung electronics co., ltd. (20250070021). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250070022). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250079305). SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Samsung electronics co., ltd. (20250087584). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Samsung electronics co., ltd. (20250087585). SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM
- Samsung electronics co., ltd. (20250096133). INTEGRATED CIRCUIT DEVICE
- Samsung electronics co., ltd. (20250096134). INTEGRATED CIRCUIT DEVICE
- Samsung electronics co., ltd. (20250096135). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 5th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
