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Category:CPC H01L23/49838
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Pages in category "CPC H01L23/49838"
The following 200 pages are in this category, out of 257 total.
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- 18069044. PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract (QUALCOMM Incorporated)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)
- 18120172. HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER simplified abstract (Intel Corporation)
- 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18170612. SUBSTRATE EMPLOYING VERTICAL CONDUCTOR LOOPS FOR COUPLING NOISE REDUCTION IN RADIO-FREQUENCY (RF) TRANSMISSION LINES, AND RELATED ANTENNA MODULES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18208415. REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
- 18216521. HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18217725. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18219018. INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER (Intel Corporation)
- 18236664. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18239167. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18290422. SEMICONDUCTOR PACKAGE simplified abstract (LG INNOTEK CO., LTD.)
- 18334188. PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES (Intel Corporation)
- 18340193. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18351975. FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18379034. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18401789. Power Switches in Interconnect Structures and the Method Forming the Same (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18409547. INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
- 18427614. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18443166. SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 18444982. ELECTRONIC COMPONENT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18457535. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18460471. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract (QUALCOMM Incorporated)
- 18464259. CHIP ON FILMS AND DISPLAY MODULES simplified abstract (Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.)
- 18464926. METHOD AND MATERIAL SYSTEM FOR TUNABLE HYBRID BOND INTERCONNECT RESISTANCE (Applied Materials, Inc.)
- 18468474. IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION (QUALCOMM Incorporated)
- 18469243. Electronic Package Molded Vertical Interconnection (Apple Inc.)
- 18474336. STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18534143. UNIVERSAL CHIP WITH VARIABLE PACKAGING simplified abstract (Meta Platforms Technologies, LLC)
- 18539949. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18583970. RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING RADIO FREQUENCY MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18594446. ELECTRONIC DEVICE simplified abstract (MEDIATEK INC.)
- 18599624. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18607849. CHIP-ON-FILM PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18607907. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18613414. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18623666. SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18626395. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
- 18630784. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18634101. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18652315. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652515. APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18657689. ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE simplified abstract (Texas Instruments Incorporated)
- 18668974. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18672532. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18675646. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18731407. ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18734056. PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18735475. Packaged Device, Power Module, and Electronic Apparatus simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18751036. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18753091. CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18756426. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18809460. CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE (Infineon Technologies AG)
- 18814715. SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR STORAGE DEVICE (Kioxia Corporation)
- 18825412. SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18946965. SEMICONDUCTOR PACKAGE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18949968. PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE (CXMT Corporation)
A
- Advanced micro devices Patent Application Trends in 2024
- Apple inc. (20250096096). Electronic Package Molded Vertical Interconnection
- Apple Inc. patent applications on March 20th, 2025
- Applied materials, inc. (20250087573). METHOD AND MATERIAL SYSTEM FOR TUNABLE HYBRID BOND INTERCONNECT RESISTANCE
- Applied Materials, Inc. patent applications on March 13th, 2025
D
H
- HITACHI ENERGY LTD Patent Application Trends in 2024
- Huawei technologies co., ltd. (20240321718). PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE simplified abstract
- HUAWEI TECHNOLOGIES CO., LTD. Patent Application Trends in 2025
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
- Hyundai Motor Company Patent Application Trends in 2024
- HYUNDAI MOTOR COMPANY Patent Application Trends in 2025
- Hyundai Motor Company patent applications on March 6th, 2025
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract
- Intel corporation (20240274521). METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240304536). HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER simplified abstract
- Intel corporation (20240332153). DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION simplified abstract
- Intel corporation (20240332155). SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS simplified abstract
- Intel corporation (20240421062). PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES
- Intel corporation (20250006616). HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Intel corporation (20250014980). INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on August 15th, 2024
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on January 9th, 2025
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- Intel Corporation patent applications on September 12th, 2024
- International business machines corporation (20240234284). DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY simplified abstract
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 11th, 2024
K
- Kabushiki Kaisha Toshiba Patent Application Trends in 2025
- Kioxia corporation (20250096102). SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR STORAGE DEVICE
- Kioxia Corporation Patent Application Trends in 2024
- Kioxia Corporation patent applications on March 20th, 2025
- Korea Electronics Technology Institute Patent Application Trends in 2024
- KYOCERA CORPORATION Patent Application Trends in 2024
L
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- MediaTek Singapore Pte. Ltd. Patent Application Trends in 2024
- Meta platforms technologies, llc (20240312892). UNIVERSAL CHIP WITH VARIABLE PACKAGING simplified abstract
- Meta Platforms Technologies, LLC patent applications on September 19th, 2024
- Micron technology, inc. (20240282691). APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS simplified abstract
- Micron technology, inc. (20240312890). SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- Micron Technology, Inc. patent applications on August 22nd, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
- Microsoft Technology Licensing, LLC Patent Application Trends in 2024
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Murata manufacturing co., ltd. (20240250013). RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING RADIO FREQUENCY MODULE simplified abstract
- Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
P
Q
- Qualcomm incorporated (20240203860). PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240250009). EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240282688). SUBSTRATE EMPLOYING VERTICAL CONDUCTOR LOOPS FOR COUPLING NOISE REDUCTION IN RADIO-FREQUENCY (RF) TRANSMISSION LINES, AND RELATED ANTENNA MODULES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract
- Qualcomm incorporated (20250096094). IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on August 22nd, 2024
- QUALCOMM Incorporated patent applications on July 25th, 2024
- QUALCOMM Incorporated patent applications on June 20th, 2024
- QUALCOMM Incorporated patent applications on March 20th, 2025
- QUALCOMM Incorporated patent applications on September 26th, 2024
R
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- Samsung display co., ltd. (20250006620). FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- Samsung Display Co., LTD. patent applications on January 2nd, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194577). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240213133). REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE simplified abstract
- Samsung electronics co., ltd. (20240222251). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240234285). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240234286). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240234287). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240243053). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240243054). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240250011). FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258228). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240266271). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240266272). INTERPOSER, METHOD OF DESIGNING INTERPOSER, AND METHOD OF MANUFACTURING INTERPOSER simplified abstract
- Samsung electronics co., ltd. (20240266276). STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312894). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240321708). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321712). CHIP-ON-FILM PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321713). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321715). PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332157). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240379524). SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240404936). STACKED STRUCTURE INCLUDING CONDUCTIVE PATTERN FOR SELF-ALIGNMENT
- Samsung electronics co., ltd. (20240413071). SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Samsung electronics co., ltd. (20240429151). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20240429153). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Samsung electronics co., ltd. (20250006618). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250006619). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Samsung electronics co., ltd. (20250022787). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250022788). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Samsung electronics co., ltd. (20250062210). SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION THEREOF
- Samsung electronics co., ltd. (20250062211). DRIVING CIRCUIT MOUNTING FILM
- Samsung electronics co., ltd. (20250062212). SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
- Samsung electronics co., ltd. (20250062213). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250062214). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250070012). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250079287). SEMICONDUCTOR PACKAGES
- Samsung electronics co., ltd. (20250096098). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250096099). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250096103). SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 5th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
