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Category:CPC H01L23/4735
Pages in category "CPC H01L23/4735"
The following 10 pages are in this category, out of 10 total.
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- Intel corporation (20250014967). METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL LOADING OF INTEGRATED CIRCUIT PACKAGES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on January 9th, 2025