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Category:CPC H01L21/76804
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Pages in category "CPC H01L21/76804"
The following 30 pages are in this category, out of 30 total.
1
- 18381907. SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDEWALL AND METHOD FOR PREPARING THE SAME (NANYA TECHNOLOGY CORPORATION)
- 18497096. VIA SHAPING BETWEEN METAL LAYERS FOR CONTROLLED RESISTANCE (Applied Materials, Inc.)
- 18520114. SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDEWALL AND METHOD FOR PREPARING THE SAME (NANYA TECHNOLOGY CORPORATION)
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SONY GROUP CORPORATION Patent Application Trends in 2024
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 23rd, 2025