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Category:C09J7/38
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This category has the following 19 subcategories, out of 19 total.
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Pages in category "C09J7/38"
The following 55 pages are in this category, out of 55 total.
1
- 18147515. METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES simplified abstract (Intel Corporation)
- 18235528. PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18243725. WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18255998. PRESSURE-SENSITIVE ADHESIVE simplified abstract (LG CHEM, LTD.)
- 18262421. RELEASE LINER FOR SILICONE ADHESIVE LAYER, AND LAMINATE AND ROLL BODY INCLUDING THE RELEASE LINER simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18269727. ADHESIVE WITH THERMALLY REVERSIBLE, COVALENT CROSSLINKS simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18282708. ADHESIVE TAPE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18284250. TRANSPARENT, HEAT RESISTIVE, ADHESIVE TAPE WITH ANTISTATIC PERFORMANCE AND METHOD OF USE THEREOF simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18289537. MULTILAYER PRESSURE-SENSITIVE ADHESIVE FOAM TAPE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18431243. NANO-CAPSULE, AND COMPOSITION, FILM, AND ELECTRONIC APPARATUS, INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18485059. SEALING TAPE FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME simplified abstract (SAMSUNG SDI CO., LTD.)
- 18572573. PRESSURE-SENSITIVE ADHESIVES PREPARED USING POLYETHER-CONTAINING MACROMER simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18574409. METHOD FOR PRODUCING WATER-SOLUBLE POLYMER, METHOD FOR PRODUCING WATER-ABSORBENT POLYMER, WATER-SOLUBLE POLYMER, AND WATER-ABSORBENT POLYMER simplified abstract (NITTO DENKO CORPORATION)
- 18575968. COMPOSITE ADHESIVE FIRE BARRIER AND METHOD OF MAKING AND USING THE SAME simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18578033. AQUEOUS PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR RECYCLING-COMPATIBLE PRESSURE-SENSITIVE ADHESIVE LABELS simplified abstract (BASF SE)
- 18628941. ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18661489. SEALING TAPE FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME (Samsung SDI Co., Ltd.)
- 18676639. PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18679075. PROTECTIVE FILM STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18722422. ADHESIVE COMPOSITION AND PREPARATION METHOD THEREOF, AND OPTICAL ADHESIVE FILM AND APPLICATION THEREOF (HUAWEI TECHNOLOGIES CO., LTD.)
- 18723704. COMPOSITE ADHESIVES (3M INNOVATIVE PROPERTIES COMPANY)
- 18830163. THERMO-SWITCHABLE PRESSURE-SENSITIVE ADHESIVES (Northeastern University)
2
- 20240026189. BIAXIALLY ORIENTED POLYESTER RELEASE LINER, ADHESIVE BACKED ARTICLE ASSEMBLY AND METHOD OF MAKING SAME simplified abstract (Unknown Organization)
- 20240052210. ADHESIVE SHEET AND DISPLAY BODY simplified abstract (LINTEC CORPORATION)
- 20240087940.WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (samsung electronics co., ltd.)
3
- 3m innovative properties company (20240343944). Preparation of High Molecular Weight Polymers with Minimal Gel Content simplified abstract
- 3m innovative properties company (20240343948). PRESSURE-SENSITIVE ADHESIVE TAPE INCLUDING SULFUR AND RELATED PROCESSES simplified abstract
- 3M INNOVATIVE PROPERTIES COMPANY patent applications on February 20th, 2025
- 3M INNOVATIVE PROPERTIES COMPANY patent applications on October 17th, 2024
B
H
- Huawei technologies co., ltd. (20250059409). ADHESIVE FILM AND PREPARATION METHOD THEREOF, COMPOSITE ASSEMBLY, AND ELECTRONIC DEVICE
- Huawei technologies co., ltd. (20250066652). ADHESIVE COMPOSITION AND PREPARATION METHOD THEREOF, AND OPTICAL ADHESIVE FILM AND APPLICATION THEREOF
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 20th, 2025
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on February 27th, 2025
I
- Intel corporation (20240222182). METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES simplified abstract
- Intel corporation (20240327679). MEDIA TRAY WITH SWITCHABLE ADHESION simplified abstract
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on October 3rd, 2024
L
S
- Samsung display co., ltd. (20240318049). NANO-CAPSULE, AND COMPOSITION, FILM, AND ELECTRONIC APPARATUS, INCLUDING THE SAME simplified abstract
- Samsung Display Co., Ltd. patent applications on March 6th, 2025
- Samsung Display Co., Ltd. patent applications on September 26th, 2024
- Samsung electronics co., ltd. (20240309244). PROTECTIVE FILM STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract
- Samsung electronics co., ltd. (20240312826). PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250062152). DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING THE SAME
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
