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Category:Benjamin Duong of Phoenix AZ (US)
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This category has the following 2 subcategories, out of 2 total.
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Pages in category "Benjamin Duong of Phoenix AZ (US)"
The following 42 pages are in this category, out of 42 total.
1
- 17948586. THIN FILM CAPACITORS simplified abstract (Intel Corporation)
- 17957094. GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INTEGRATED CIRCUITS simplified abstract (Intel Corporation)
- 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)
- 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
- 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17958012. AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract (Intel Corporation)
- 18071246. INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES simplified abstract (Intel Corporation)
- 18089471. THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)
- 18090260. ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation)
- 18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation)
- 18121264. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18121331. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18133353. OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation)
- 18217123. SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER (Intel Corporation)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation)
- 18756679. METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES simplified abstract (Intel Corporation)
I
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240107784). METHODS AND APPARATUS UTILIZING CONJUGATED POLYMERS IN INTEGRATED CIRCUIT PACKAGES WITH GLASS SUBSTRATES simplified abstract
- Intel corporation (20240111093). GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INTEGRATED CIRCUITS simplified abstract
- Intel corporation (20240111095). HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract
- Intel corporation (20240113007). AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract
- Intel corporation (20240113046). EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract
- Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract
- Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240176167). INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES simplified abstract
- Intel corporation (20240213132). THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract
- Intel corporation (20240213301). THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract
- Intel corporation (20240219644). ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract
- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract
- Intel corporation (20240222035). PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract
- Intel corporation (20240312853). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240312888). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240327201). MEMS DIES EMBEDDED IN GLASS CORES simplified abstract
- Intel corporation (20240331921). ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS simplified abstract
- Intel corporation (20240332100). GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240345324). OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
- Intel corporation (20240347402). METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES simplified abstract