XMEMS Labs, Inc. Patent Application Trends in 2024
xMEMS Labs, Inc. Patent Filing Activity
xMEMS Labs, Inc. patent applications in 2024
Top 10 Technology Areas
- B81B2203/0307 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se)
- H04R1/1016 ({Earpieces of the intra-aural type})
- Count: 2 patents
- Example: 20240121547. Venting Device and Venting Method Thereof simplified abstract (xMEMS Labs, Inc.)
- H04R7/06 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general)
- H04R7/18 (at the periphery)
- H04R31/003 ({for diaphragms or their outer suspension})
- B81C1/00158 (Manufacture or treatment of devices or systems in or on a substrate ()
- B81B2203/01 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se)
- B81C2203/051 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons)
- H03B5/1243 (active element in amplifier being semiconductor device ()
- H03B5/1206 ({using multiple transistors for amplification})
Emerging Technology Areas
- B81B2207/03 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se)
- B81B2203/0163 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se)
- B81B2203/0127 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se)
- B81B2201/0257 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se)
- H04R31/00 (Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general)
- B81B3/0072 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes ()
- B81B3/0051 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes ()
- B81B3/0021 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes ()
- H04R2201/003 (Mems transducers or their use (of the electrostatic type)
- H04R19/02 (Loudspeakers ()
Top Inventors
- Wen-Chien Chen (5 patents)
- Jemm Yue Liang of Sunnyvale CA (US) (4 patents)
- Chiung C. Lo of San Jose CA (US) (4 patents)
- Jye Ren (3 patents)
- Chao-Yu Chen (2 patents)
- Hao-Hsin Chang (2 patents)
- Chun-I Chang (2 patents)
- Jing-Meng Liu of San Jose CA (US) (1 patent)
- Kai-Chieh Chang (1 patent)
- Yuan-Shuang Liu (1 patent)
Patent Categories
Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
Categories:
- XMEMS Labs, Inc.
- Companies
- CPC H03B5/1243
- CPC H03B5/1206
- CPC H03B5/30
- CPC H04R1/1041
- CPC H04R1/1016
- CPC H04R2460/11
- CPC B81B3/0097
- CPC B81B2203/0118
- CPC B81B2203/0307
- CPC H04R1/2811
- CPC H04R1/24
- CPC H04R19/02
- CPC H04R2201/003
- CPC H04R7/06
- CPC H04R7/18
- CPC H04R31/003
- CPC B81C1/00158
- CPC B81B2203/01
- CPC B81C2203/051
- CPC B81B3/0021
- CPC B81B3/0051
- CPC B81B3/0072
- CPC H04R31/00
- CPC B81B2201/0257
- CPC B81B2203/0127
- CPC B81B2203/0163
- CPC B81B2207/03
- Patent Trends by Company in 2024