US Patent Application 18446146. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Hua Chen of Zhubei City (TW)
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446146 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Simplified Explanation
The abstract describes a method for forming package structures, specifically for placing a first package within a recess of a first substrate and attaching a first sensor to the first package and substrate.
- The method involves placing a first package containing a first die into a recess of a first substrate.
- A first sensor is then attached to both the first package and the first substrate.
- The first sensor is electrically connected to both the first package and the first substrate.
Original Abstract Submitted
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.