METHOD AND SYSTEM FOR SCANNING WAFER

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor(s)

PEI-HSUAN Lee of TAIPEI CITY (TW)

CHIEN-HSIANG Huang of HSINCHU (TW)

KUANG-SHING Chen of HSINCHU (TW)

KUAN-HSIN Chen of HSINCHU (TW)

CHUN-CHIEH Chin of HSINCHU (TW)

METHOD AND SYSTEM FOR SCANNING WAFER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18359871 titled 'METHOD AND SYSTEM FOR SCANNING WAFER

Simplified Explanation

The patent application describes a method and system for scanning wafers.

The system captures an image of a defect on a wafer.
It generates a reference image using a reference image generation model.
The system then creates a defect marked image by combining the defect image and the reference image.

Original Abstract Submitted

The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.