US Patent Application 18323820. SUBSTRATE PROCESSING APPARATUS simplified abstract

SUBSTRATE PROCESSING APPARATUS

Organization Name

TDK CORPORATION

Inventor(s)

Yohei Sato of Tokyo (JP)

Hiroshi Koizumi of Tokyo (JP)

Osamu Shindo of Tokyo (JP)

Mitsuyoshi Makida of Tokyo (JP)

Masashi Matsumoto of Tokyo (JP)

SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18323820 titled 'SUBSTRATE PROCESSING APPARATUS

Simplified Explanation

The patent application describes a substrate processing apparatus that includes a lower jig plate, columnar members, and a heat dissipating column.

• The lower jig plate is used to arrange a substrate that needs to be pressurized.
• The columnar members support the lower jig plate.
• The heat dissipating column comes into direct or indirect contact with the lower jig plate.
• The heat dissipating column has a higher heat dissipation property compared to the columnar members.
• The purpose of the heat dissipating column is to efficiently dissipate heat generated during substrate processing.
• This innovation aims to improve the overall performance and efficiency of the substrate processing apparatus.

Original Abstract Submitted

A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.