US Patent Application 17751941. SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA simplified abstract
SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA
Organization Name
Inventor(s)
SHING-YIH Shih of NEW TAIPEI CITY (TW)
SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA - A simplified explanation of the abstract
This abstract first appeared for US patent application 17751941 titled 'SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA
Simplified Explanation
The patent application describes a semiconductor structure with an elastic member placed inside a via.
- The structure includes a wafer with a substrate, a dielectric layer beneath the substrate, and a conductive pad surrounded by the dielectric layer.
- A passivation layer is placed over the substrate.
- A conductive via extends from the conductive pad through the substrate, passivation layer, and partially through the dielectric layer.
- An elastic member is positioned within the conductive via.
Original Abstract Submitted
The present application provides a semiconductor structure having an elastic member within a via. The semiconductor structure includes a wafer including a substrate, a dielectric layer under the substrate, and a conductive pad surrounded by the dielectric layer; a passivation layer disposed over the substrate; a conductive via extending from the conductive pad through the substrate and the passivation layer and partially through the dielectric layer; and an elastic member disposed within the conductive via.
