US Patent Application 17661622. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
SEMICONDUCTOR PACKAGE AND METHOD
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chuei-Tang Wang of Taichung (TW)
Chien-Yuan Huang of Hsinchu (TW)
SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17661622 titled 'SEMICONDUCTOR PACKAGE AND METHOD
Simplified Explanation
The patent application describes a device that includes two semiconductor devices bonded together using a bonding layer.
- The device also includes thermal structures made of a conductive material, which are placed beside the second semiconductor device and on the bonding layer.
- These thermal structures are electrically isolated from both semiconductor devices.
- An encapsulant is then applied on the bonding layer, surrounding the second semiconductor device and the thermal structures.
- Finally, a second bonding layer is placed over the encapsulant, the thermal structures, and the second semiconductor device.
Original Abstract Submitted
A device includes a first semiconductor device including a first bonding layer; a second semiconductor device bonded to the first bonding layer of the first semiconductor device; thermal structures disposed beside the second semiconductor device and on the first bonding layer, wherein the thermal structures include a conductive material, wherein the thermal structures are electrically isolated from the first semiconductor device and from the second semiconductor device; an encapsulant disposed on the first bonding layer, wherein the encapsulant surrounds the second semiconductor device and surrounds the thermal structures; and a second bonding layer disposed over the encapsulant, the thermal structures, and the second semiconductor device.