FILM FORMING APPARATUS FOR METAL FILM

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FILM FORMING APPARATUS FOR METAL FILM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240344224 titled 'FILM FORMING APPARATUS FOR METAL FILM

The film forming apparatus described in the patent application is a device that deposits a metal film onto a base material using a plating solution and electrolyte film.

The apparatus includes a container with a plating solution, an electrolyte film covering the opening of the container facing the base material, and a positive electrode above the electrolyte film.
A power source applies a voltage between the positive electrode and the base material, with the positive electrode having curved surfaces facing the electrolyte film and a through hole passing through it.
The curved surfaces on the positive electrode are arranged in a convex manner towards the electrolyte film, allowing for efficient metal film deposition on the base material.

Potential Applications: - This technology can be used in the manufacturing of electronic components, such as circuit boards. - It can also be applied in the production of decorative metal finishes on various products.

Problems Solved: - Provides a more efficient and precise method for depositing metal films on base materials. - Helps in achieving uniform and high-quality metal coatings on surfaces.

Benefits: - Increased productivity and cost-effectiveness in metal film deposition processes. - Enhanced quality and consistency in the final product finishes.

Commercial Applications: "Advanced Metal Film Deposition Technology for Electronic Manufacturing and Surface Finishing"

Questions about the technology: 1. How does the curved surface design of the positive electrode improve the metal film deposition process? 2. What are the key advantages of using this film forming apparatus compared to traditional methods?

Original Abstract Submitted

the film forming apparatus is a device that forms a metal film on the surface of a base material. the film forming apparatus includes a container containing a plating solution, an electrolyte film that covers an opening of the container formed at a position facing the base material, and a positive electrode disposed above the electrolyte film in the container. it includes a power source that applies a voltage between the positive electrode and the base material. on the surface of the positive electrode, a surface facing the electrolyte film has a plurality of curved surfaces arranged in a convex manner toward the electrolyte film. a through hole passing through the positive electrode is formed between the plurality of curved surfaces.